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Tue 9 Jun | 10:10 - 11:50
156AB
This session highlights recent advances in scalable mm-Wave to sub-THz phased-array transceivers and front-end architectures targeting high-data-rate communications and high-resolution sensing. The presented works span E-band, D-band, and frequencies beyond 200 GHz, demonstrating CMOS/SiGe and III-V HEMT implementations that push efficiency, output power density, bandwidth, and integration scalability. Key themes include wideband beam-steering transmitters, compact and reconfigurable T/R switching for TDD operation, die-to-die stitching approaches enabling wafer-scale phased arrays, and multi-channel beamforming.
10:10 - 10:30
Tu2F-1 E-Band 2×2 Unit Phased Array with Die-to-Die Stitching Scalability for Wafer-Scale Phased Array Systems
10:30 - 10:50
Tu2F-2 A D-Band SiGe TDD Front-End Featuring a Compact Asymmetric T/R Switch Enabled by Dual-Mode Reconfigurable Coupled-Lines
10:50 - 11:10
Tu2F-3 A 140 GHz 4-Channel High Power Density Beamforming Front-End in 40-nm Bulk CMOS
11:10 - 11:30
Tu2F-4 Dual-Channel Tx/Rx-Front-Ends for High Resolution Radar at 160 GHz
11:30 - 11:50
Tu2F-5 A 230-GHz Wideband High-Efficiency Beam-Steering 1×2 Phased-Array Transmitter in 40-nm CMOS