IMS2026 Schedule

The field of quantum computing relies heavily on the advancements in microwave technology. However, a gap exists between the microwave engineering community and the quantum research effort. To bridge this divide and propel the quantum industry forward, it is crucial to cultivate a new generation of engineers proficient in
both microwave engineering and quantum physics. These multidisciplinary experts will be essential in driving innovation in quantum sensing, communication, and the control of quantum computing platforms, particularly those based on superconducting qubits. Initiatives like the Quantum Boot Camp aim to address this need
by providing microwave engineers with foundational knowledge in quantum engineering, emphasizing the design, fabrication, control, and measurement of quantum systems. By equipping engineers with this expertise, the program seeks to empower them to contribute meaningfully to this rapidly evolving technological landscape. The program caters to a diverse audience, including recent graduates, career changers, and marketing professionals, all seeking to deepen their understanding of quantum technology and its practical implications.

Distributed Amplifier (DA) architectures have long been valued for their ability to deliver exceptionally wide bandwidths. In recent years, new design strategies and circuit techniques in various technologies have dramatically expanded their potential in applications ranging from high-speed optical and wireless communication to defense, instrumentation, radar, and sensing. This workshop will provide a comprehensive overview of recent research and development in distributed amplifiers, focusing on performance improvements across bandwidth, output power, linearity, noise, and efficiency enhancement. Emphasis will be given to implementations across multiple technology platforms including CMOS, SiGe BiCMOS, GaN, and InP technologies, highlighting the unique opportunities and challenges in each domain.

The ever-increasing demand for higher network capacity, and the volume of different devices that need connectivity, require innovative solutions. In mobile applications, this demand is addressed in 5G and 6G networks by using microwave links with massive Multiple-Input Multiple-Output (MIMO) antenna arrays to support high data-rate connectivity between large number of devices with improved coverage. However, the capacity is still limited by the available RF spectrum. Radio-over-fiber (RoF) systems combined with MIMO technology offer a flexible and powerful solution for extending the reach and improving the performance of wireless networks. In data center application, the hybrid opto-electrical links presents numerous advantages over single technology solutions. Energy efficiency, higher throughput, scalability and cost can be optimized by proper convergence of the two technologies. In this workshop, experts from industry and academia will discuss the latest developments in the convergence of the opto-electrical technology as applied to mobile networks and data center connectivity.

This bootcamp will present the basics of AI/machine learning (ML) and their applications to microwave engineering. It is intended for engineers who want to learn the basics of AI/ML or are interested in using AI/ML for microwave applications, marketing and sales professionals who are interested in understanding the basics and relevance of AI/ML for microwaves, professionals with AI/ML expertise seeking to explore potential applications to MHz-to-THz technologies, and university students who like to acquire the basic knowledge of AI/ML.
To this end, the bootcamp includes introductory presentations on the fundamentals of AI/ML, covering supervised, unsupervised and reinforcement learning. Moreover, we will introduce common types of neural networks such as fully connected artificial neural networks (ANNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), long-short term memory networks (LSTMs), generative adversarial networks (GANs). We will discuss their function, training cost, relative advantages and limitations, as well as their suitability to various applications. We will also introduce concepts such as generalizability (i.e. the accuracy of neural networks to cases outside their training set) and overfitting (when the network learns training data well, but fails to generalize to new cases).
Examples of applications of AI/ML to microwave engineering to be presented include: electromagnetic modeling and optimization, microwave filter modeling/design, GaN HEMT modeling, Doppler radar based human motion recognition, gesture recognition and object identification, radio coverage prediction and design optimization of reconfigurable intelligent surfaces.
The course will provide ample opportunities for audience interaction and Q&A.

This workshop will present recent breakthroughs in the design of Voltage Controlled Oscillators (VCOs) and frequency multipliers, with a focus on innovations spanning the microwave, mm-wave, and sub-THz frequency bands. As these components are critical enablers in emerging communication, radar, and sensing systems, the workshop will cover both theoretical insights and practical design strategies that push the boundaries of performance, integration, and power efficiency. Bringing together leading experts from both academia and industry, the sessions will highlight state-of-the-art circuit techniques, emerging device technologies, and system-level considerations. Presentations will explore various aspects of VCO and frequency multiplier design, aiming to achieve low noise, wide tuning range, and high efficiency. The workshop will also address key challenges in scaling designs to higher frequencies and more compact integration.

The workshop takes a deep dive into systems and circuits at the forefront of the next generation wireless technology for commercial and defense applications. Bringing together leading experts from both academia and industry, the talks will highlight trade-offs in MIMO systems that motivate the use of analog, digital and hybrid beamforming with a focus on parameters like coverage, spectral and energy efficiency, bandwidth and throughput. Emerging device technologies, state-of-the-art design techniques for RF, analog and digital circuits, advanced packaging integration and thermal management will also be presented, providing a comprehensive view of the direction in which wireless systems are heading.

Generative AI and Large Language Models (LLMs) are beginning to change how electromagnetic and RF systems are specified, synthesized, and verified. Although these tools are common in software and data science, their use in microwave engineering is nascent and requires careful, physics-aware evaluation. This full-day workshop spotlights state-of-the-art methods that connect AI generation to EM reality, moving beyond proofs-of-concept toward validated models and workflows engineers can use today. Technical content centers on three pillars — (1) Inverse EM / spec-to-layout and end-to-end design: “Generative AI Methods for Wireless Propagation Prediction” (Costas Sarris) shows diffusion and GANs for real-time, generalizable indoor propagation maps and super-resolution; “AI-enabled End-to-End RF and RFIC Design” (Kaushik Sengupta) discusses inverse-design and generative AI approaches for automated synthesis of complex RF passives, multi-port elements, antennas, and spec-to-GDS RFIC flows combining reinforcement learning and inverse design; “Empowering Optimal Design of RF Devices by Generative AI” (Dominique Baillargeat and Francisco Chinesta) introduces rank-reduction autoencoders as generative surrogates for RF circuits and antennas; “An Autonomous Agentic Framework for Deep Inverse Photonic Design” (Willie Padilla) presents an agentic, autonomous inverse-design workflow for metamaterials, illustrating how AI agents can accelerate spectrum-to-structure design paradigms relevant across EM domains — (2) LLM-augmented EDA workflows and ML foundations: “Practical Considerations for Applying AI to RF and Microwave EDA Workflows” (Matthew Ozalas) and “Accelerating Innovation: AI-Driven Advances in Sigrity, Clarity, and Optimality” (Jian Liu) highlight Keysight’s and Cadence’s strategies for GenAI/LLM-aided design; Complementary talks cover attention mechanisms for non-linear circuit modeling (Qi-Jun Zhang) and multiphysics-informed, data-free ML for RFIC design (Dan Jiao) — (3) Multimodal LLMs: “Multimodal LLMs for Electromagnetic Waves” (Zhi Jackie Yao) fuses image-based EM data with text via a BLIP bridge into pretrained LLMs for EM reasoning and design assistance. Rigor and trust will be discussed throughout. Talks and discussion will cover dataset curation, generalization, solver-in-the-loop constraints (passivity/causality/manufacturability), independent EM/measurement validation, and secure integration into EDA flows, along with practical guardrails to avoid hallucinations and constraint violations. For attendees new to this intersection, the workshop includes short primers, reproducible examples, and simple evaluation checklists to separate signal from hype.

Next-generation wireless systems Beyond-5G will place unprecedented demands on radio front-ends across all frequency ranges, from sub-6GHz (FR1) to the upper mid-band (FR3) and into mm-wave spectrum. Each band presents its own trade-offs in terms of coverage, capacity, propagation, and spectrum availability, but they share common challenges: fragmented allocations, coexistence with incumbent services, and the need for spectrally agile, energy-efficient, and highly integrated transceivers. The upper mid-band (FR3, ∼6–24GHz) is a prime example. Compared to congested FR1 allocations, it offers an order of magnitude more bandwidth, while avoiding some of the severe propagation penalties of mm-wave frequencies above 28GHz. These advantages make FR3 highly attractive for wide-area enhanced broadband and low-latency applications, but also introduce stringent coexistence requirements with incumbent scientific, defense, and satellite users. The resulting emphasis on spectrum awareness and frequency agility highlights design challenges that resonate across all frequency ranges. This workshop will explore the circuit- and architecture-level innovations needed to enable broadband, reconfigurable, and spectrally agile radios. Topics include: Wideband, reconfigurable LNAs and PAs with high linearity and efficiency; Frequency-agile local oscillators and synthesizers with fast switching, low phase noise, and fine resolution; Wideband filtering and duplexing strategies using tunable, switched-capacitor, or acoustic/EM-based solutions; Digital-assisted calibration and adaptation, including ML-based techniques for resilience against PVT variations; Scalable architectures in advanced CMOS and SiGe technologies, enabling multi-band, multi-standard, and multi-antenna integration with energy efficiency. By bringing together experts from academia, industry, and government laboratories, the workshop will highlight state-of-the-art circuit techniques and cross-layer considerations — including spectrum policy, system-level trade-offs, and co-designed RF/digital intelligence — that are critical to realizing the next generation of programmable, energy-efficient, spectrally agile radios.

Are we there yet? — a world where radios and SoCs for IoT and countless other domains are truly battery free? What would it take to go beyond a smart toaster to a future with ubiquitous ambiently powered sensors that work seamlessly with the existing wireless devices and infrastructure. This workshop addresses these questions by bringing together a unique mix of top industry, research and academic speakers with expertise ranging from RFICs to SoCs. Apart from the current state of the low-power radios, the talks will discuss circuits and system architectures that have the potential to achieve 1000× improvements in energy efficiency. The workshop and concluding panel session also aims to explore salient features which the front-ends, integrated energy harvesters, and overall systems must provide to continue the evolution of ambient IoTs.

This workshop will focus on the design and implementation of FR3 Power Amplifiers. It will cover technology considerations, circuit implementation and topology consideration for PAs in this frequency range. Both Silicon, GaAs and GaN circuit examples and techniques are discussed, as well as DPD and broadband circuit techniques. The speakers are from both academia and industry.

The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies, from mm-wave to sub-THz bands. The flexibility required from these systems to support multiple functionalities leads to the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing performance and functional density while reducing the size and cost of next-generation RF systems. However, the shift to 3DHI also introduces a new set of challenges, ranging from novel processes and substrates to RFIC/MMIC design, packaging and thermal management. This workshop brings together leading experts from academia and industry to present the latest advances and design methodologies in heterogeneous integration and advanced packaging technologies for mm-wave and sub-THz applications. The talks span a wide range of critical topics, including interposer-based system integration, advanced simulation techniques, integration of III-V technologies, SiGe and CMOS platform optimization, and co-packaged system testing and calibration.

The rapid progress in quantum computing has made microwave engineering a key enabler of nearly all major hardware platforms, including superconducting qubits, spin qubits, trapped ions, etc. Each of these technologies relies on advanced microwave techniques for control, coupling, readout, and scaling, demanding approaches that go well beyond classical electromagnetics. This creates a great opportunity for microwave engineers to make lasting contributions to the development of quantum computing and related technologies. The need for ultra-low-noise amplification, high-fidelity readout, and crosstalk suppression has stimulated novel device designs, often requiring hybrid approaches that combine electromagnetic modeling with quantum theory. Similar challenges appear in other quantum platforms; for example, trapped-ion processors demand stable and phase-coherent microwave delivery for multi-qubit gates, while spin qubits rely on advanced microwave control schemes. At the algorithmic level, quantum computing is increasingly viewed as a potential game-changer for electromagnetics and related fields. Specialized quantum algorithms promise significant acceleration for tasks such as solving integral equations, optimizing antenna radiation patterns, or addressing NP-hard problems in inverse scattering and system design. While fully fault-tolerant quantum computing remains a long-term goal, near-term noisy intermediate-scale quantum devices are already serving as valuable testbeds. Hardware-aware algorithm design, ie tailoring quantum algorithms to the specific strengths and limitations of physical devices, is becoming an essential strategy for identifying useful applications in the presence of noise and limited coherence times. This workshop will highlight state-of-the-art advances at the interface of microwave engineering, quantum hardware development, and quantum algorithm design. Contributions will cover multiple quantum platforms, emphasizing both their unique microwave engineering challenges and the unifying principles that connect them. A particular focus will be placed on industrial perspectives, including scalability, reliability, and manufacturability of microwave components for large-scale quantum systems. Industry engagement is crucial, as commercial interest and investment in quantum computing have surged dramatically, creating demand for engineers who can translate fundamental concepts into deployable technologies. To ensure accessibility, the workshop will open with a comprehensive tutorial introducing the basics of quantum theory in the language of microwave engineering. This will help participants from the RF and microwave community engage with the specialized concepts of quantum physics and better appreciate their role in quantum device design. The program will then feature a series of invited talks from leading experts in academia and industry, with topics spanning theoretical methods, quantum hardware, and algorithmic perspectives. By bringing together specialists from diverse quantum hardware platforms, algorithm developers, and industrial leaders, this workshop will provide a unique forum for exchanging ideas, identifying cross-platform synergies, and further drafting the engineering roadmap toward practical, scalable quantum computing.

With the operating frequencies of 6G wireless communications and next-generation automotive radars extending above 110GHz, accurate and robust on-wafer measurements are essential for enabling design, model verification, and industrialization. While a solid foundation has been established over the past decades in calibration methodologies and measurement platforms, many challenges remain as research and development move deeper into the sub-THz domain. As advanced devices, circuits, interposers/packaging technologies emerge alongside high-frequency systems, new measurement scenarios and calibration requirements continue to arise. At the same time, new methodologies such as AI-driven automation, advanced calibration algorithms, and novel calibration substrates are being developed to address these evolving needs. This full-day workshop brings together international experts from national metrology institutes, academia, and industry to address these challenges from complementary perspectives. The program begins with a focus on the fundamentals of calibration and measurement, reviewing the state-of-the-art in instrumentation, calibration techniques, and traceability at mm-wave frequencies, followed by comprehensive design guidance for calibration standards and systematic analysis of probe-induced uncertainties. These sessions lay the foundation for reliable and reproducible on-wafer measurements at sub-THz frequencies, offering both the theoretical framework and practical guidance needed for advancing calibration practices. The workshop then transitions to next-generation tools and methodologies that are extending the state-of-the-art. Topics include AI-driven nano-robotic probe stations that achieve sub-micron alignment and reproducible probe placement, calibration algorithms that go beyond conventional error models to capture mode conversion and crosstalk, and the development of GaAs impedance standard substrates supporting diverse calibration standards and measurement scenarios. Recent advances in broadband vector network analyzer technology will also be presented, including single-sweep measurements up to 250GHz and new calibration capabilities. These contributions demonstrate how innovative approaches are being translated into practical platforms, enhancing both robustness and scalability. Finally, the workshop highlights applications and industrial implementations. Talks will show how advanced calibration and measurement techniques are applied in wafer-scale silicon interposer technologies — addressing stackup choices, GSG pad design, and multimode suppression — as well as in high-volume silicon device testing for next-generation components. Presentations from industrial experts will emphasize optimizing calibration substrates, comparing methodologies such as modal versus SOLR calibration, and reducing measurement uncertainties under real manufacturing constraints. Together, these examples illustrate how academic innovation and industrial practice are converging to enable accurate and traceable measurements at scale. By covering the full spectrum from fundamentals to industrialization, this workshop offers participants both foundational insights and exposure to cutting-edge solutions. The day will conclude with an open discussion, providing a forum to exchange ideas, identify open challenges, and shape the roadmap for accurate, scalable, and robust on-wafer sub-THz measurements.

The D-band frequency range is gaining attention for both radar and communication applications due to potential system miniaturization related to smaller wavelength and the possibility of having larger bandwidth. There is an ongoing frequency regulation activity at ETSI, ECC and FCC on standardization of new frequency bands, targeting bandwidth >10GHz. Large bandwidth is beneficial for radar to achieve good range resolution, while for communication applications one can achieve higher data-rates. Pushing operation frequencies even further beyond the D-band towards 300GHz may offer even more potentially large available unregulated bandwidth. However, these high operation frequencies reach the technological limits imposed by the available CMOS processes. Operating the transistors at frequencies beyond half of the achievable ft/fmax makes it very difficult to obtain sufficient gain and power from an amplifier stage. One possible solution would be to use III-V technologies, which offer ft/fmax frequencies by far exceeding those of advanced CMOS nodes. Still, the possibility of integrating the mm-wave front-end with the digital baseband on the same chip makes CMOS very attractive despite this mentioned drawback. Another challenge that comes at higher frequencies are the higher losses of the interconnects. The packaging possibilities. Realization of antennas (on-chip or in-package?). As well, much higher propagation losses make the link budget very challenging and make it very hard to reach ranging or communication over large distances. In this full-day workshop we will address exactly these questions: (a) does it make sense to go to frequencies above 100GHz? Or shall we stay in the comfort zone below 100GHz?; (b) for which applications does it makes sense at all?; (c) what are the circuit related challenges in silicon-based technologies and how can we solve them?; (d) what are the challenges not only to build an SoC, but to actually build a system >100GHz?; (e) discuss emerging applications that might profit by very high frequencies. Level budget considerations for various mm-wave systems will be discussed. Fair and unbiased opinions will be given by experts. The workshop features distinguished speakers from leading companies and academia, who will present their view on mm-wave circuits >100GHz, as well as sharing their “best practice” on how to design mm-wave circuits. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Scaled antenna arrays that support multiple simultaneous beams can enable significant throughput improvements and new capabilities for both communications and sensing applications. These benefits provide the form-factor and spectral efficiencies required for next generation wireless systems. However, beam scaling also scales up traditional design challenges and creates new implementation hurdles. For example, handling the signal distribution and processing for hundreds of antennas and tens of beams quickly results in stages that are power and thermally infeasible. Innovations in multi-beam array architectures are indispensable to overcoming these challenges for emerging satellite communications, radar, and 6G applications. To succeed in real-world deployments these innovations must be developed with resilience, cost-effectiveness, and hardware scalability considerations in mind. This workshop explores specifically multi-beam topics with an array of experts presenting their work on re-imagining how to architect and build point-to-multi-point arrays at scale. Approaches for beam-scaling in frequency, space, and time will be explored and hardware implementations that range from RF-centric to mostly digital will be covered. The goal is to provide attendees with an in-depth overview of this emerging area of antenna array design, and cast light on trade-offs and future directions.

Increasing demand for continuous information flow and uninterrupted connectivity requires next-generation communication and sensing systems to support higher data-rates and wideband operation. As a result, wireless systems are moving to higher frequencies, offering wider bandwidth and higher channel capacity, while simultaneously reducing the system size. Although lower mm-wave bands, such as V-band (40–75GHz), have been explored as a potential solution to meet the demand for high-speed connectivity, the elevated levels of atmospheric attenuation create an additional challenge for maintaining signal power in wireless transmission over long distances. On the other hand, the upper portion of the mm-wave spectrum at 110–300GHz, also known as G-band, offers a promising path to achieve higher data-rates in point-to-point links, defense applications, localization, ranging, and other multi-user communication scenarios as the underutilized portion of the EM spectrum, while enabling higher resolution in radars and other sensing systems for biomedical or security screening and also reducing the size of all these systems. The sub-THz spectrum above 200GHz is of particular interest due to lower atmospheric attenuation. However, building high-performance integrated circuits and systems at G-band poses significant disadvantages due to the lower available gain of the transistors and higher noise contribution from components, leading to higher power consumption and reduced sensitivity at these sub-THz frequencies. Therefore, a combination of advanced circuit design techniques and system-level innovations, state-of-the-art high-speed devices harnessing the properties of compound semiconductors, heterogeneous integration, and co-design with packaging is essential to overcome the inherent challenges of the G-band design space. This workshop provides a comprehensive and in-depth review of the latest academic and industrial research on innovative techniques and cutting-edge technologies for realizing high-data-rate wireless communication and radar systems at 110–300GHz across SiGe, scaled-CMOS, InP, and GaN platforms, with particular focus on designs above 200GHz in the upper G-band. First, novel circuit techniques and topologies to enable high-power generation with maximum power efficiency, advanced high-speed device design and optimization in compound semiconductor processes, as well as III-V RF front-ends and hybrid InP/CMOS phased arrays above 200GHz, will be presented. State-of-the-art SiGe BiCMOS transceiver arrays across the entire G-band will be showcased with an emphasis on ultra-compact design and 2D scalability, along with multiple demonstrations of modular beamforming ICs supporting up to 200Gbps wireless transmission, wideband radar transceiver chips for integration in large MIMO arrays, and upper G-band MMICs enabling radar systems with multi-target resolution down to a few millimeters while maintaining an absolute ranging accuracy on the order of 1µm. In addition, system- and circuit-level design considerations for record-low-power CMOS radar sensor systems will be reviewed. Finally, co-design and co-integration of sub-THz ICs in SiGe and SOI with glass interposer technology and 3-D Heterogeneous Integrated (3DHI) phased arrays incorporating an antenna on glass, GaN-on-SiC MMICs, a silicon interposer, and a silicon Beam Forming Integrated Circuit (BFIC) will be presented as a pathway toward end-to-end communication modules in G-band for commercial and defense applications.

Emerging applications such as Low Earth Orbit (LEO) satellite-based internet and geolocation services are rapidly expanding, driven by commercial efforts to deliver low-cost satellite connectivity to consumers. However, space environments present unique challenges not encountered in terrestrial systems, including radiation-induced errors, extreme temperature fluctuations, and limited power availability. Systems operating beyond LEO face even more severe higher levels of environmental degradations. This workshop will bring together leading experts from academia and industry, spanning both LEO SATCOM and traditional space-based systems, to provide a comprehensive overview of the key design challenges and state-of-the-art techniques required for reliable RF system performance in space.

As our society and economy continue to accelerate toward digitalization, the density of connected wireless nodes is increasing rapidly—with estimates suggesting up to ten million devices operating within a single square kilometer. This unprecedented growth raises major sustainability challenges, particularly due to the widespread use of batteries for powering wireless devices. Wireless Power Transfer (WPT) offers a transformative solution by delivering power without physical connections or disposable energy sources. By reducing dependence on batteries and minimizing material waste, WPT technologies contribute to a more sustainable, cost-effective, and scalable infrastructure for the connected world.
The WPT Boot Camp at IMS 2026 will introduce participants to both near-field and far-field WPT technologies in a format that integrates industrial and academic perspectives. Industry speakers will present the current state of the art, including commercially available systems, standardization efforts, and emerging market opportunities. Academic experts will complement these talks with discussions on the theoretical foundations and ongoing research aimed at pushing WPT capabilities beyond existing limits.
A central feature of the boot camp will be live demonstrations, giving participants hands-on experience with operational WPT systems and the opportunity to interact directly with the presenters. This highly interactive format ensures that attendees gain both a practical understanding of existing solutions and insights into future technological directions.
The boot camp is open to engineers, students, and professionals from industry and academia who wish to deepen their understanding of WPT technologies, explore their applications, and engage with experts driving innovation in this rapidly evolving field.

Next-generation communications and sensing systems operating in the mm-wave range require a collaborative effort among the various components that make up the subsystems to enhance performance and reduce production costs. This workshop will bring together leading researchers from different fields of mm-wave phased arrays to discuss the key requirements and challenges relevant to their areas of expertise. The half-day workshop will kick off with a unique perspective on mm-wave phased arrays from industry and government representatives, providing context for the challenges and requirements in this field. The remainder of the workshop will feature internationally renowned speakers specializing in transistors, integrated circuits, packaging, and heterogeneous integration, as well as phased arrays. Interactive discussions will be prioritized throughout the event to encourage engagement among participants.

The frontier of next-generation radar is shaped by advances in mm-wave, UWB, and AI-assisted phased array technologies. In the D-Band, SiGe implementations enable instantaneous bandwidths up to 56GHz, delivering millimeter-level resolution and unlocking applications in imaging, non-destructive testing, and metrology. In parallel, UWB radar provides low-power, high-precision sensing for presence detection, vital-sign monitoring, and in-cabin safety. Complementing these developments, AI-driven phased arrays are emerging as enablers of adaptive beamforming, joint radar-communications (ISAC), and scalable multi-antenna architectures. This talk will highlight circuit and system design challenges, analog front-end techniques, and prototype results, illustrating how SiGe mm-wave, UWB, and AI-enhanced phased arrays together define the future of high-resolution radar.