We1G: Advances in Packaging and 3D Manufacturing Technologies

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Wed 10 Jun | 08:00 - 09:40
Room 156AB
Manos Tentzeris
Georgia Tech
Kamal Samanta
AMWT
This session highlights key advances in novel 3D components, substrate technologies, and subsystem packaging, including Multi-Chip Modules (MCMs) and additive manufacturing techniques such as metal and 3D printing. The papers explore heterogeneous integration and shape-changing materials, alongside technologies operating above 100GHz. Featured works include high-efficiency PAs, pH sensors, and low-cost techniques for reconfigurable antenna elements and lenses.
08:00 - 08:20
We1G-1 KEYNOTE: Greek Words, Big Technology: The New Language of Advanced Packaging
ABSTRACT
George Dogiamis
Deca Technologies
08:20 - 08:40
We1G-2 Demonstration of an F-Band Heterogeneously Integrated Multi-Chip Downconverter
ABSTRACT
Caitlyn Cooke, Kevin Leong, Michael Eller, Maxwell Duffy, Nancy Lin, Xiaobing Mei, K.K. Loi, Alfonso Escorcia, Khanh Nguyen, Samuel Esparza, William Deal
Northrop Grumman Corp.
08:40 - 09:00
We1G-3 Toward 5G Wearables: An Additively Manufactured, Thermoelectric Powered mmID and Integrated Microfluidic pH Sensor
ABSTRACT
Theodore W. Callis, Marvin Joshi, Genaro Soto-Valle, Manos M. Tentzeris
Georgia Tech
09:00 - 09:20
We1G-4 Redefining Lensing with Adaptive Metastructures: An Ultrawideband Reconfigurable 3D-Printed Metalens for Future Wireless Front-Ends
ABSTRACT
Marvin Joshi, Kexin Hu, Charles A. Lynch III, Genaro Soto-Valle, Manos M. Tentzeris
Georgia Tech
09:20 - 09:30
We1G-5 Novel 3D Film Laminate Package for High Efficiency 7GHz GaN Power Amplifier Module
ABSTRACT
Hayato Shimizu, Tatsuya Hashinaga, Yutaka Moriyama, Takeshi Kawasaki, Hideki Tango
Sumitomo Electric
09:30 - 09:40
We1G-6 Packaging and Antenna Design for a 46-Element Dual-Surface mmWave Active STAR-RIS Built with CMOS RFICs
ABSTRACT
Zijian Shao, Muhamed Allam, Wenkai Fang, Hooman Saeidi, Alexander Stepko, Kaushik Sengupta
Princeton Univ., Qualcomm Technologies