We1G: Advances in Packaging and 3D Manufacturing Technologies

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Wed 10 Jun | 08:00 - 09:40
156AB
Manos Tentzeris
Georgia Institute of Technology
Kamal Samanta
AMWT LTD
This session highlights key advances in novel 3D components, substrate technologies, and subsystem packaging, including multi-chip modules (MCMs) and additive manufacturing techniques such as metal and 3D printing. The papers explore heterogeneous integration and shape-changing materials, alongside technologies operating above 100 GHz. Featured works include high-efficiency PAs, pH sensors, and low-cost techniques for reconfigurable antenna elements and lenses.
08:00 - 08:20
We1G-1 KEYNOTE: Onshoring advanced packaging to the USA
Georgios Dogiamis
08:20 - 08:40
We1G-2 Demonstration of an F-Band Heterogeneously Integrated Multi-Chip Downconverter
ABSTRACT
Caitlyn Cooke, Kevin Leong, Michael Eller, Maxwell Duffy, Nancy Lin, Xiaobing Mei, K.K. Loi, Alfonso Escorcia, Khanh Nguyen, Samuel Esparza, William Deal
Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp., Northrop Grumman Corp.
08:40 - 09:00
We1G-3 Toward 5G Wearables: An Additively Manufactured, ThermoelectricPowered mmID and Integrated Microfluidic pH Sensor
ABSTRACT
Theodore Callis, Marvin Joshi, Genaro Soto Valle Angulo, Manos Tentzeris
Georgia Institute of Technology, Georgia Institute of Technology, Georgia Institute of Technology, Georgia Institute of Technology
09:00 - 09:20
We1G-4 Redefining Lensing with Adaptive Metastructures: A UltrawidebandReconfigurable 3D-Printed Metalens for Future Wireless Front-Ends
ABSTRACT
Marvin Joshi, Kexin Hu, Charles Lynch, Genaro Soto Valle Angulo, Manos Tentzeris
Georgia Institute of Technology, Georgia Institute of Technology, Georgia Institute of Technology, Georgia Institute of Technology, Georgia Institute of Technology
09:20 - 09:30
We1G-5 Novel 3D Film Laminate Package for High Efficiency 7 GHz GaN Power Amplifier Module
ABSTRACT
Hayato Shimizu, Tatsuya Hashinaga, Yutaka Moriyama, Takeshi Kawasaki, tango hideki
Sumitomo Electric Device Innovations, Sumitomo Electric Device Innovations, Sumitomo Electric Device Innovations, Sumitomo Electric Device Innovations, Sumitomo Electric Device Innovations
09:30 - 09:40
We1G-6 Packaging and Antenna Design for a 46-element Dual-surface mmWave Active STAR-RIS built with CMOS RFICs
ABSTRACT
Zijian Shao, Muhamed Allam, Wenkai Fang, Alexander Stepko, Hooman Saeidi, KAUSHIK Sengupta
Princeton Univ., Princeton Univ., Princeton Univ., Princeton Univ., Qualcomm Technologies, Inc., Princeton Univ.