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Thu 11 Jun | 10:10 - 11:50
Room 151AB
This session highlights recent advances in sub-THz and THz circuits and components, spanning signal generation, frequency translation, reception, and waveguide technologies. The five papers include a 312GHz low-voltage push-push oscillator in GaAs pHEMT technology, a broadband CMOS frequency doubler with high fundamental suppression, and a sub-milliwatt receiver MMIC achieving low noise across a wide bandwidth. Complementing these active circuits are innovations in THz signal routing and multiplication, including metallized 3D-printed 1THz hollow waveguide components and a 480–530GHz balanced frequency quadrupler based on Schottky-varactor diodes integrated on a micromachined silicon membrane.
10:10 - 10:30
Th2A-1 A Sub-mmW Receiver MMIC Achieving a 6.8-dB Average Noise Figure Over a >190-GHz Bandwidth
10:30 - 10:50
Th2A-2 A 265–317-GHz Frequency Doubler with an Asymmetric Marchand Balun Achieving >40-dBc Fundamental Rejection in 65-nm CMOS
10:50 - 11:10
Th2A-3 A 1-V, 19.2-mW, 308-GHz Push-Push Balanced Colpitts Oscillator in 70-nm GaAs pHEMT Technology
11:10 - 11:30
Th2A-4 A 480–530GHz Balanced Frequency Quadrupler Based on Schottky Varactor Diodes Integrated on a Micromachined Silicon Membrane
11:30 - 11:50
Th2A-5 Metallized 3D Printed THz Hollow Waveguide Components