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Tue 9 Jun | 08:00 - 09:40
Room 255
Sajjad Moazeni
Univ. of Washington
Sushil Subramanian
Intel Corp.
Next-generation optical interconnects must achieve 200G/400G data rates per lane to support future intra-datacenter requirements. This session showcases high-performance optical transmitter and receiver building blocks engineered to meet these scaling demands. Presentations will cover a diverse range of cutting-edge material platforms and processes, including SiGe, CMOS, Thin-Film Lithium Niobate (TFLN), and InP, highlighting their roles in achieving the necessary power efficiency and signal integrity for the next era of data centers.
08:00 - 08:20
Tu1J-1 A 460 Gb/s PAM-4 Linear Distributed Driver with 105 GHz BW for TFLN Modulators in 130nm SiGe BiCMOS
Leandro da Silva, Cedric Bruynsteen, Jakob Declercq, Armands Ostrovskis, Fabio Pittala, Guy Torfs, Nishant Singh, Xin Yin
Ghent Univ., IMEC, Keysight Technologies
08:20 - 08:40
Tu1J-2 A 200-Gb/s Low-Noise TIA in 28-nm CMOS
Feiyang Zhang, Jianyu Yang, Yifei Xia, Zhixing Zhang, Ruixuan Yang, Liang Zhao, Wenxin Zhang, Cailing Li, Zetong Zhang, Shenlei Bao, Binhao Wang, Li Geng, Dan Li
Xi'an Jiaotong Univ., Univ. of Chinese Academy of Sciences
08:40 - 09:00
Tu1J-3 A 4×212 Gbps 3.34pJ/bit Electronic-Photonic Co-Designed Transmitter Chipset in 0.18-um SiGe BiCMOS and 90nm Silicon Photonics
Ziyue Dang, Ziyu Deng, Ye Liu, Qiansheng Wang, Zhicheng Wang, Ziying Xie, Min Tan, Xi Xiao
Huazhong Univ. of Science & Technology, National Optoelectronics Innovation Center
09:00 - 09:20
Tu1J-4 A 55-GHz Bandwidth PAM-4 InP DHBT Photoreceiver Based on PD–TIA Co-Design for >112-GBd Optical Transceivers
Antoine Chauvet, Romain Hersent, Fabrice Blache, Filipe Jorge, Marie Da-Rocha Amaro, Karim Mekhazni, Harry Gariah, Nil Davy, Colin Mismer, Virginie Nodjiadjim, Michel Goix, Agnieszka konczykowska, Bertrand Ardouin, Christophe Caillaud, Abed-Elhak Kasbari, Achour Ouslimani
Nokia-Bell Labs, LEA Laboratory