WMA: Advanced Design and Integration/Packaging of Power Amplifiers and Front-End Modules

Presentation Abstract
In advanced mobile and wireless communication systems, including for sub-6GHz and mm-wave 5G and 6G, the integration and packaging of PA with other circuits has recently gained significant attention for enhancing electrical performances and achieving reduced size and integration cost. At the same time, in a front-end module (FEM), power amplifiers are considered the most expensive and critical component, dissipating high power within a compact space. PA’s thermal management and integration (considering electromagnetic interference) are crucial in achieving the required system performance with high reliability and repeatability. This workshop will focus on recent advances in PA design techniques, co-designing power amplifiers with other active (like, LNA, PS) and passive components (including filter, antennas) and integration, packaging, and thermal management techniques for realizing high-performance FEMs. It will present superior PA and FEM performance utilising advanced materials and techniques, including a diamond composite material compatible with II-V semiconductors and bond wires matching technique-based fully integrated PA. Furthermore, it will showcase wafer-level and chipset-based packaging of PA using silicon interposer and co-designing and integrating with passives and other RF (GaAs/GaN) and Si/CMOS circuits into a single substrate and demonstrating state-of-the-art output power and efficiency, enhancing integration and reducing manufacturing costs.