IWTU1: Addressing Next Generation Intelligent Wireless Connectivity using Emerging Materials and Technology Solutions

Presentation Abstract
The next generation of wireless connectivity network will incorporate increasing intelligence to efficiently and reliably address emerging applications like XR, teleporting, low latency links for and among automated vehicles. At the heart of this future intelligent network, there’ll be hardware based on novel technologies and materials that can enable high data throughput and energy-efficient sustainable connectivity. This workshop will highlight examples of some of the R&D activities ongoing in the industry in terms of emerging materials and technologies covering 3 key aspects a) engineered substrate b) innovative RF technologies and c) wafer-scale packaging with heterogeneous integration.