IWTU3: System Budgeting to System Realization - A 14nm FinFET 48GHz FEM for Next-Generation 5G/6G Applications

Presentation Abstract
This workshop explores recent developments in design, analysis, and implementation workflows driven by electromagnetic (EM)/thermal analysis, RF circuit/antenna co-simulation, and phased array synthesis addressing hardware-validated silicon-to-antenna co-design for emerging 5G applications at 48GHz, the n262 band. A link budget analysis of FEM in a system simulator determines block specifications catering to early package, PCB floorplanning, and thermal challenges. Co-design of FEM with packaged antenna is implemented on Samsung’s 14nm FinFeT process, including low-power LNAs and reliable p-FinFET PAs. The presented unified chip, package, PCB co-design methodology highlights importance of heterogeneously integrated workflows for first-pass silicon success at advanced mmWave.