IWTU4: 3D Heterogeneous Integration (3DHI) Solutions for Design of Phased Array Systems

Presentation Abstract
3D Heterogeneous Integration (3DHI) promises to bring the ‘holy grail’ of technology advancements: best of breed ICs, dense packaging, and reconfigurable, vendor-agnostic ‘plug and play’ solutions. But how will you choose the right ICs, interposers, and packages, and how will you actually design these complex systems with commercial EDA tools? Participants will learn about the latest trends in heterogeneous integration, technologies specifically designed to address dense packaging of these components, and finally will walk through a demonstration of an EDA tool flow for analysis of electrical, EM, and thermal behavior of a complete 3DHI assembly for phased array applications.