TUMA15: In-Design Multiphysics Analysis For Assessing, Validating, and Mitigating Thermal Impacts of Semiconductor Devices

Presentation Abstract
The ability to understand the thermal impact on performance has become a necessity for today’s complex electronic designs. Having an integrated thermal analysis tool within a multiphysics system design flow proves to be very beneficial for determining overall performance and becomes necessary to maintain design flow synchronization. This paper demonstrates the capabilities of the Cadence Celsius Thermal Solver, an electrothermal co-simulation solution that provides analysis and design insights to detect and mitigate thermal issues early in the design cycle. Simulations are validated with measurements on devices designed for thermal imaging and current density performance.