TUMA23: RF 3D Heterogeneous Integration (3DHI) Physical Design and Simulation

Presentation Abstract
3D Heterogeneous Integration is becoming a trend in the RF/MW industry to integrate mixed technologies (Silicon RFICs, III-V MMICs, packaging, passives, antennas and PCBs) into convenient drop in RF modules to enable the exponential growth of RF applications for high throughput wireless data transport demanded by commercial and defense-aerospace AI/Machine Learning requirements. This microapps paper illustrates how RF EDA tools are now enabling 3DHI physical assembly, 3D RF routing and connectivity verification, followed by EM-circuit co-simulation/co-optimization of any RF path through the 3DHI structure. Electrothermal simulation is also enabled to accurately predict 3DHI RF performance in actual field deployment scenarios.