THMA3: EM Plugs for RF ICs; Practical EM Models for Fast and Accurate RF Design

Presentation Abstract
Designing-in high frequency RF ICs requires special attention for proper chip to substrate transitions, including RF landing patterns, substrate/pad parasitics, and solder/wire-bond profiles: •Designers often struggle to replicate the RF IC performance on another substrate or transition then recommended, as traditional s-parameter models fail to capture the critical chip-to-substrate transitions. •Analog Devices, introduces a new unencrypted transition-based EM model approach, “Em-Plugs”, to the industry enabling precise performance predictions across varying substrates and transitions. •This approach predicts the s-parameters performance accurately at high frequencies up to 90 GHz while eliminating the need for multiple PCB iterations, resulting faster design cycles.