THMA9: Advancing RF Technologies: The Role of Wafer Level Test in 6G, AI and Quantum Computing

Presentation Abstract
RF technologies are evolving rapidly, with significant advancements such as miniaturization in Antenna in Package (AiP), enhanced QBIT fidelity for quantum computing, and deeper integration of THz technologies into AI and machine learning for network management, data processing, and decision-making. As these technologies progress from concept to fabrication to data centers, ensuring reliability at ultra-low temperatures, reducing costs, and improving power consumption and efficiency are crucial for successful market deployment. Wafer-level testing is becoming increasingly critical in achieving these goals. This keynote will explore the intersection of wafer-level testing and its essential role in advancing RF technologies for 6G, AI, and quantum computing.