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Thu 19 Jun | 10:10 - 11:50
203
Advanced Packaging and Integration Technologies up to Sub-Thz Frequencies
This session introduces multiple state-of-the-art technologies for packaging and integration up to sub-THz frequency bands. Specifically the papers to be presented will cover novel low-loss shielded interconnects for D-band/sub-THz applications, 3D heterogeneous integrated RF glass-interposer system-in-package architectures, novel waveguide launcher in interposer package technologies for automotive imaging radars, highly scalable RF dielets embedded in glass interposer and thin film transmission lines on low-k polymer films.
10:10 - 10:30
Th2A-1 Novel Low-Loss Shielded Interconnects for D-band/sub-THz Applications Using Microscale Metal Printing Technologies
10:30 - 10:50
Th2A-2 3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
10:50 - 11:10
Th2A-3 High Performance Waveguide Launcher in Interposer Package Technology for 77/79GHz Automotive 4D Imaging Radar
11:10 - 11:20
Th2A-4 First Demonstration of Highly Scaled RF GaN-on-Si Dielets Embedded in Glass Interposer
11:20 - 11:30
Th2A-5 Thin Film Transmission Lines on Low-k Polymer Films for Sub-THz Applications