Th3D: (Joint with ARFTG) On-Wafer Measurement Structures and Processes

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Thu 19 Jun | 13:30 - 15:10
208
(Joint with ARFTG) On-Wafer Measurement Structures and Processes
Shuhei Amakawa
Hiroshima Univ.
Jon Martens
Anritsu
Higher frequencies, higher levels of integration and new measurement environments, including cryogenic, are driving changes to on-wafer measurement procedures and equipment. In this joint IMS/ARFTG session, we will review a number of new processes, techniques, and different equipment constructs to help meet these evolving requirements. Topics include on-wafer versions of comprehensive mm-wave mixer measurements, on-wafer power calibration techniques, multiport calibration methods, and ways of dealing with thermally extreme environments.
13:30 - 13:50
Th3D-1 KEYNOTE: Past, Present and Future Challenges of Testing RFIC Industry
ABSTRACT
Gerardo Orozco
Emerson
13:50 - 14:10
Th3D-2 Integrated Solution for Linear and Non-Linear Single-Touchdown On-Wafer Characterization of D-Band Mixers
ABSTRACT
Patrick Umbach, Nico Riedmann, Fabian Thome, Martin Vossiek, Rüdiger Quay
Fraunhofer IAF, Rohde & Schwarz, Fraunhofer IAF, FAU Erlangen-Nürnberg, Fraunhofer IAF
14:10 - 14:30
Th3D-3 Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies
ABSTRACT
Zerui Gao, Carmine de Martino, Marco Pelk, Steffen Lehmann, Marco Spirito
Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft, GLOBALFOUNDRIES, Technische Universiteit Delft
14:30 - 14:50
Th3D-4 Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
ABSTRACT
R. Schalk, M. Lont, T.H. Both, L. Tiemeijer, M. Neofytou, G. Radulov, V. Vidojkovic, K. Doris
Technische Universiteit Eindhoven, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven
14:50 - 15:00
Th3D-5 Cryogenic Microwave Probe Technology with High Thermal Insulation
ABSTRACT
Tomonori Arakawa, Junta Igarashi, Shota Norimoto, Noriyoshi Hashimoto, Makoto Minohara, Nobu-Hisa Kaneko, Hiroyuki Kayano
AIST, AIST, AIST, AIST, AIST, AIST, AIST
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