IWTu1: Thermal Management Simulation and Design for RF 3D Heterogeneous Integration

Presentation Abstract
3D Heterogeneous Integration promises huge improvements to size, weight, power, and cost (SWAP-C) while maintaining or improving performance through choice of best-in-class electronics, components, and packaging. But with this increased system density comes additional physical challenges such as thermal management. Advanced electronics design and advanced packaging design need to consider the thermal generation and thermal management processes together to realize the true benefits of 3DHI. Join 3D Glass Solutions and Keysight for an investigation into the design of an advanced electronic system using thermal-aware electronic design processes to explore this complex interaction and determine the best thermal management solution