IWTu4: Heterogeneous Integration of III-V Technologies with Si ones to address 6G RF Challenges

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Tue 9 Jun | 10:10 - 11:50
154
Heterogeneous Integration of III-V Technologies with Si ones to address 6G RF Challenges
Pascal Chevalier, Frederic Gianesello, Florinel Balteanu, Luis Andia
ST, Skyworks Inc., Soitec
By 2025, the global mobile cellular subscriber count is forecasted to surpass 6 billion, with 5G paving the way for high-data capacity and low-latency through sub-6GHz and mm-Wave spectrum. 6G networks will hinge on 7-15GHz FR3 bands, a pivotal shift in mobile connectivity. The global rise of smartphones owes much to CMOS technology advancements to smaller nodes, computational power, and digital calibrations. This workshop explores current 5G RF-FEM designs at the heart of this transformation, addressing implementation challenges and discussing 6G FR3 ones. The semiconductor roadmap envisioned for 6G FR3 will be discussed, focusing on the integration of III-V/Si technologies.