IWWe2: Engineering Challenges & Solution Deployment for High-Speed Signal Design Beyond 200 Gbps in Data Centers & Backplanes

Presentation Abstract
As serial link data rates push past 200 Gbps, precise characterization of high-speed interconnects becomes critical. traditional measurement approaches are increasingly limited by fixture effects, probe parasitic, and frequency-dependent losses that can mask true device performance. A glance at advanced de-embedding techniques that separate the behavior of test fixtures and measurement equipment from the device under test, enabling accurate modeling and validation at extreme bandwidths will be open for discussion. This workshop bring together researchers, system architects and test labs to address multidisciplinary engineering challenges and near-term deployment solutions for electrical and mixed electrical-optical interconnects operating beyond 200 Gbps.