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Thu 11 Jun | 12:00 - 13:30
156C
Inter-Society Technical Panel: Carbon Footprint of RF Technologies
Jungchih Chiao, Ravinder Dahiya, Mahmoud Wagih, Pieter Cardinael, Erik Heilman
Southern Methodist Univ., Northeastern University, University of Glasgow, UK, University of Louvain, Belgium, IEEE-USA
Sulekha Chattopadhyay, Ke Wu
Environmental Engineering and Science Academy, Department of Electrical Engineering, Center of Radiofrequency Electronics Research (CREER) of Quebe
This inter-society technical panel will emphasize the urgent need for sustainable growth within the RF industry, particularly through the development of standards for measuring the carbon footprint of RF technologies. Today, the environmental impact of RF systems extends across the full lifecycle—from manufacturing processes and material usage to deployment, energy consumption, and long-term operation. However, the absence of consistent measurement frameworks makes it difficult to evaluate, compare, and ultimately reduce these impacts in a systematic way. The panel will bring together experts from multiple societies to explore how collective action can establish widely accepted methodologies and best practices for carbon footprint assessment in RF technologies. By working across organizational boundaries, societies can not only help define these standards but also provide strategic guidance to industry, academia, and policymakers. Such efforts are critical to ensuring that sustainability becomes a foundational consideration in future RF innovations rather than an afterthought. Ultimately, the discussion will highlight how professional societies can play a pivotal role in shaping a greener future for the RF industry—by fostering collaboration, driving standardization, and offering direction to reduce carbon emissions across both manufacturing and operational domains.