WEMA3: Simulation methodology for co-packaged or hybrid-bonded multi-technology 3D RF system in a single virtuoso cockpit

Abstract
This microapp deals with the RF and EM simulation of a design using multiple process and PDKs for 3D integration. It presents step by step the design and simulation of a front-end device (10GHz LNA + Bypass switch) targeting Satcom application. The TPS65RSC SOI Switch is flipped on top of the SiGe TPS65SG6 LNA, either bumped or using hybrid wafer bonding. No modification of existing pdk or EM process file is required. Both die are co-EM simulated using EMX and co-optimized in a single test bench. We will conclude by presenting the simulation results of the entire system.