WEMA9: The Development and Commercialization of a Disruptive High Performance PCB Substrate

Abstract
Printed Circuit Board (PCB) substrates have developed from materials we consider primitive today, like Bakelite and cardboard. The first PCB substrate using copper foil was invented in 1943. Safety and electrical performance have developed the PCB substrate industry into a diversified world of many different solutions for the wide array of complex electronic applications that exist today. This paper addresses the pathway of development and commercialization of a disruptive solution to the needs of RF/microwave industry for a PCB substrate that provides a low dielectric constant, low dissipation factor material, that is easily processable and environmentally safe. See attachment.