WEMA19: A Systems-to-Microelectronics Engineering Framework with Multiphysics to Bridging System-level Requirements and RF Component Parameters

Abstract
The workflow establishes a tightly integrated system-to-microelectronics process that unifies SysML requirements modeling with multi-domain RF and thermal simulations for rapid development of advanced microwave systems. By linking mission-level performance metrics to RF component parameters through reduced-order and behavioral models, it enables engineers to assess architectures, validate COTS or custom components, and predict system behavior under realistic conditions. An automated, error-mitigating digital backbone removes manual transfer steps and ensures rigorous traceability. The result is faster design cycles, earlier risk detection, and greater confidence that hardware implementations will satisfy requirements, improving the efficiency and reliability of complex RF system development.