THMA5: Using Thin Film Sputtering Technologies to Create New Bias Options

Abstract
Broadband Bias T components include large footprint inductors, at least 100 mil in every direction, to avoid disturbing the transmission line while providing the connection for DC bias. With the use of thin film sputtering, the bias line can be connected to the transmission line in a way that has minimal impact on the broadband RF performance. Using resistive metals, these lines can attenuate any RF signal, allowing the DC current to flow freely onto the line. A proposed example is 0603 footprint with loss less than 1dB through 30 GHz and 2dB through 45 GHz.