THMA11: Material Measurements in the 1-170 GHz range supporting AI and other emerging technologies

Abstract
Development of new technologies concerned with AI and high-speed communication systems requires precise material characterization at the use conditions, which are concerned with operation frequency,operation temperature as well as actual material thickness from single microns up to few millimeters.This ability supports minimization of signal loss in electronic devices.Seminar will present microwave characterization of solid dielectrics as well as copper foils both used in PCB industr,AI systems, etc.Moreover, newly developed techniques support measurements of dielectric properties of coolant liquids allowing for development of efficient immersion cooling systems crucial for demanding AI centers,and in-situ liquid life cycle monitoring for quality inspection.