ED2 Corporation
ED2 Corporation is a Tucson-based semiconductor and RF/microwave technology company developing advanced high-frequency components, modules, and packaging solutions for defense, aerospace, wireless communications, space, sensing, and next-generation 5G/6G systems. Its core differentiation is Advanced Glass Packaging Technology™ (AGPT™), a fused-silica heterogeneous integration platform designed to deliver compact, low-loss, thermally stable RF, analog, mixed-signal, and mmWave systems, including products such as phased-array modules, tunable filter banks, mixers, antennas, filters, and glass-based multi-chip modules.
Booth:
18112