Flexiramics B.V.

Flexiramics B.V. introduces a new materials platform - flexible ceramics - as a drop-in replacement for glass cloth used in electronics applications. Our material delivers 4× higher lateral heat dissipation, solving one of the biggest bottlenecks in advanced packaging and RF modules. Unlike glass, which faces major supply-chain constraints, long lead times, and limited global capacity, our solution is scalable, manufacturable, and ready for volume adoption. And at high frequencies, we achieve up to 80% lower signal loss compared to glass, enabling cleaner RF performance, lower power consumption, and tighter integration. If you are building the next generation of RF, power, or high-density substrates, you will want to see what this material can unlock.
Booth: 13082I

Product Tags

Materials: Ceramics Materials: Laminates Materials: Printed Circuit Boards Materials: Substrates