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Sun 15 Jun | 08:00 - 17:20
306
Sub-THz Power Amplifiers in CMOS, SiGe, and III-V
The power amplifier is one of the most critical blocks in the transceiver and obtaining the desired performance from the PA at sub-THz frequencies remains a challenge. At sub-THz frequencies, transistors suffer from reduced gain impacting the performance of the PA. Designing sub-THz PAs with improved power added efficiency (PAE), output power, and linearity is an active area of research. SiGe and III-V technologies such as InP and GaN demonstrate higher fT and fmax than CMOS and as a result, sub-THz PAs designed in these technologies outperform their CMOS-based counterparts. On the other hand, CMOS can achieve better yield and higher level of integration compared to III-V technologies. In this workshop, the speakers will present recent developments in sub-THz PA design in CMOS, SiGe, and III-V technologies demonstrating their comparisons and trade-offs.
08:00 - 17:20
WSL-1 InP HBT Technologies for Sub-THz Amplifiers
08:00 - 17:20
WSL-2 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
08:00 - 17:20
WSL-3 Transformer-Based mm-Wave PA Design in CMOS, InP and GaAs
08:00 - 17:20
WSL-4 High-Power and Highly Efficient Power Amplifiers for D-Band Applications in Silicon
08:00 - 17:20
WSL-5 mm-Wave High Efficiency, High Linearity GaN HEMT, GaAs and InP HBT Power Amplifiers
08:00 - 17:20
WSL-6 E- and D-Band Common-Base Power Amplifiers in SiGe-BiCMOS with Performance Enhanced by Current Clamping and Device Stacking
08:00 - 17:20
WSL-7 Sub-THz SiGe HBT Cascode Power Amplifiers with Capacitive Feedback and its Use in a Supply Modulated RF Transmitter Front-End
08:00 - 17:20
WSL-8 Stacked-FET CMOS Power Amplifier for mm-Wave and Sub-THz Applications