WMI: Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation

Presentation Abstract
The exponential demands for higher power densities, broader frequency coverage, and enhanced reliability in microwave systems have exposed fundamental limitations in conventional thermal design approaches. As next-generation applications push beyond traditional thermal boundaries — from 5G/6G infrastructure to automotive radar and space-based communications — the industry faces a critical inflection point where incremental improvements in thermal management are essential to meet performance requirements. This workshop addresses these challenges through a comprehensive exploration of advanced thermal characterization, materials innovation, and holistic design methodologies that span from fundamental materials science to industrial-scale implementation. The program brings together leading researchers, and industry practitioners to present breakthrough approaches that are reshaping thermal management across the RF and microwave ecosystem. The technical foundation begins with the innovations in wide-bandgap materials presented by Prof. Srabanti Chowdhury of Stanford University, whose pioneering work on ultra-wide bandgap materials demonstrates how diamond integration with Beta-Gallium Oxide enables unprecedented reduction in thermal boundary resistance while maintaining RF performance. These materials advances provide the essential building blocks for next-generation thermal management solutions, particularly in high-power RF applications where conventional thermal interface materials reach fundamental limitations. Oscar D. Restrepo offers industrial thermal modeling and characterization perspectives from GlobalFoundries, where a unique combination of theoretical expertise in phonon transport and practical TCAD thermal simulation experience bridges fundamental physics with manufacturing-scale implementation. His work spans from first-principles calculations of defect formation energies to real-world thermal assessments across advanced technology nodes, including 22FDX and 12LP platforms. Building upon materials foundations, the workshop explores state-of-the-art thermal characterization techniques through both academic research and commercial implementation. Advanced thermoreflectance imaging, POSH-TDTR technology, and emerging measurement approaches demonstrate how nanosecond temporal resolution combined with submicron spatial accuracy reveals previously inaccessible thermal phenomena in operating RF devices. These characterization advances enable predictive thermal design that was previously impossible with conventional measurement techniques. Standards and validation methodologies receive dedicated attention through participation by the National Institute of Standards and Technology (NIST), which presents traceable thermal measurement techniques and validation protocols essential for industry adoption. NIST’s gate resistance thermometry methods and RF power metering standards provide the measurement foundation necessary for reliable thermal characterization across different technology platforms. The workshop culminates in a holistic design philosophy that integrates materials innovation, advanced characterization, and system-level optimization. Live demonstrations showcase how this integrated approach enables thermal-electromagnetic co-design, abandoning traditional component-level optimization in favor of system-wide performance optimization. Real-world case studies span from mm-wave antenna-in-package modules to high-power GaN amplifiers, illustrating a direct correlation between materials properties, thermal imaging data, and system performance. Interactive sessions throughout the workshop foster direct dialogue between materials researchers, device designers, and manufacturing engineers. These discussions address practical implementation challenges while exploring emerging opportunities that could reshape thermal management approaches over the next decade. The format emphasizes knowledge transfer and collaborative problem-solving rather than traditional presentation-only formats.