TUMA1: Closing the gap of Physical Design Challenges in RF Heterogeneous Integration

Abstract
More than Moore is driving interest in integrating multiple die into a single package, which brings system-level considerations for planning and placing components and die into a small space. Integrating different chip architectures and manufacturing processes necessitates sophisticated design tools and methodologies. Cadence Virtuoso Studio, enabled for multi-process technologies, brings heterogeneous integration within a single platform.