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Thu 19 Jun | 10:10 - 11:50
211
Group III-V MMICs Above D-Band Frequencies
The session focusses on advanced compound semiconductor integrated circuits for broadband and phased array applications. The session will kick-off with an invited talk on the advances in mm-wave and THz amplifier technology and design. Advanced PA, DPD, linearization, and power combining techniques will be described as well as a highly-integrated 300GHz active phased array.
10:10 - 10:30
Th2F-1 KEYNOTE: InP HBT Technologies for Integrated Circuit Development of Efficient mm-Wave and THz Power Amplifiers and Sources
10:30 - 10:50
Th2F-2 300-GHz-Band InP HBT Power Amplifier Module Enabling 280-Gbps 0-dBm Signal Generation with Digital Predistortion
10:50 - 11:10
Th2F-3 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
11:10 - 11:30
Th2F-4 208GHz InP Distributed Amplifier with Combining Loss Reduction Techniques
11:30 - 11:50
Th2F-5 A Broadband InP Darlington Amplifier with Two-Way Distributed Power Combining