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Thu 19 Jun | 10:10 - 11:50
211
Group III-V MMICs Above D-Band Frequencies
Nguyen L.K. Nguyen
Univ. of California, Davis
Kevin Kobayashi
Qorvo
The session focusses on advanced compound semiconductor integrated circuits for broadband and phased array applications. The session will kick-off with an invited talk on the advances in mm-wave and THz amplifier technology and design. Advanced PA, DPD, linearization, and power combining techniques will be described as well as a highly-integrated 300GHz active phased array.
10:10 - 10:30
Th2F-1 KEYNOTE: InP HBT Technologies for Integrated Circuit Development of Efficient mm-Wave and THz Power Amplifiers and Sources
Zach Griffith
Teledyne Scientific & Imaging
10:30 - 10:50
Th2F-2 300-GHz-Band InP HBT Power Amplifier Module Enabling 280-Gbps 0-dBm Signal Generation with Digital Predistortion
Teruo Jyo, Sam Kusano, Hiroaki Katsurai, Hiroshi Hamada, Munehiko Nagatani, Miwa Mutoh, Yuta Shiratori, Hiroyuki Takahashi
NTT, Keysight Technologies, NTT, NTT, NTT, NTT, NTT, NTT
10:50 - 11:10
Th2F-3 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
Bersant Gashi, Laurenz John, Konstantin Kuliabin, Arnulf Leuther, Rüdiger Quay
Fraunhofer IAF, Fraunhofer IAF, Albert-Ludwigs-Universität Freiburg, Fraunhofer IAF, Fraunhofer IAF
11:10 - 11:30
Th2F-4 208GHz InP Distributed Amplifier with Combining Loss Reduction Techniques
Can Cui, Nguyen L.K. Nguyen, Phat T. Nguyen, Natalie S. Wagner, Alexander N. Stameroff, Anh-Vu Pham
Univ. of California, Davis, Univ. of California, Davis, Univ. of California, Davis, Keysight Technologies, Keysight Technologies, Univ. of California, Davis
11:30 - 11:50
Th2F-5 A Broadband InP Darlington Amplifier with Two-Way Distributed Power Combining
Lianbo Liu, Zhaojing Fu, Sensen Li
Univ. of Texas at Austin, Univ. of Texas at Austin, Univ. of Texas at Austin