WMF: New Materials, Digital Manufacturing, and Integration Methods for Microwave, mm-Wave, and THz Components and Systems

Presentation Abstract
Digital manufacturing technologies are transforming RF design, packaging, and integration, leading to new capabilities and use cases for high-frequency RF components and systems. The potential to digitally manufacture RF components, alongside new materials and integration processes, offers unprecedented opportunities for improving performance, reducing size/weight, and enhancing sustainability across the lifecycle of microwave systems. However, significant challenges remain in design, the realization of digitally-processed materials and manufacturing methods, and the seamless integration of individual components to full RF systems. This workshop aims to bring together advanced RF component design methodologies, manufacturing techniques, and practical RF/microwave applications. It will provide a comprehensive overview of new design, integration, and packaging techniques for microwave, mm-wave, and THz RF systems. Specifically, the workshop will give a detailed overview of novel materials, sustainable manufacturing methods, and scalable integration schemes that facilitate the realization of high-performing, highly-functional, and highly-miniaturized RF components. The workshop will bring forward recent advances in these fields by presenting the research of leading researchers and industry experts in the fields of RF component development, digital additive manufacturing, multi-material integration, and microwave materials engineering. Discussions will include cross-disciplinary advances involving manufacturing technologies, material development, and new design methods (ie design-for-print), opening new directions for materials-enabled innovation in wireless communication, sensing, and high-frequency electronics.