TUMA20: Advances In Thermal Analysis to Address the Growing Thermal Challenges of 3D Heterogeneous Integration

Abstract
An overview of structural, mechanical, and thermal characterization techniques to address the thermal challenges of advanced integrated circuits and 3D heterogeneous packaging including the characterization of thin films and layer to layer interfaces in complex 3D structures. Ultra-fast laser-based transient thermoreflectance (TDTR), optical pump-probe imaging, and flash thermography are described. Focus is on buried structures and 3D geometries. Challenges in extracting material and interface physical parameters, identifying buried defects, and the limits in spatial resolution and measurement times are described. Characterization of bonding interfaces, multi-layer interconnects, multi-chip modules, and through-silicon vias is particularly challenging, and rapid scanning techniques are highlighted.