This work presents a compact, Watt-level SiGe HBT flip-chip power amplifier module (PAM) for emerging low earth orbit (LEO) SATCOM transmitter (TX) front-end. To attain high power yet thermal ruggedne...
This talk introduces IMEC’s 300mm RF Silicon Interposer packaging technology. Key technology modules of this approach will be introduced and the relation to different application requirements will be ...
Microwave radiometers are invaluable tools for remote sensing. The relation between the radiometer output quantity and the brightness temperature of the observed object is established by calibrating t...
An overview of the PCM RF switch technology at Tower Semiconductor will be presented. Different integrations with their advantages and disadvantages for different product applications will be discusse...