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This talk focuses on the integration of InP Power Amplifier chiplets onto imec’s 300mm RF silicon interposer technology. Combining high frequency InP transistors with a RF optimized silicon interposer...
This talk presents the advances in wireless communication focusing on the development of high-performance front-end circuits in mature 5G-and-beyond mobile technologies. It delves into the packaging d...
Integration of amplifiers with other circuits has recently gained significant attention for enhancing electrical performances and reducing circuit size. This presentation highlights advances in microw...
The boom in wireless communication system technologies and the rise of next-generation networks, such as 5G, future 6G systems and active antenna arrays, require high-performance, low-power electronic...
GaN device technologies have been increasing in power and voltage to give end users an advantage in total system cost and performance for Aerospace and Defense applications, including radar and electr...
It has been recently demonstrated that reflective-mode phase-variation permittivity sensors can take benefit from losses for sensitivity optimization, and unprecedented sensitivities have been achieve...
Modern energy saving windows, using low-emissivity (Low-E) technology, are unique and cost-effective solution. This manufacturing technology has been utilized in buildings and has increasingly been re...
In this talk, the integration of RF/microwave sensors into personal protective equipment (PPE) will be discussed, with a focus on their applications in monitoring hazardous liquids and gases. These ad...
This talk will describe the role that mm-wave-enabled backscattering technologies are playing in delivering responsive, accurate, and cost-effective localization systems. First, the use of FMCW radars...
This talk will introduce the advances in 3D printing techniques for metamaterials, meta-devices, and quasi-optics for microwave applications. Applicable to sensing, it will be shown how 3D meta-cells ...