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Three-dimensional (3D) high-integration technologies, such as GaAs, CMOS, GaN, and MEMS, enhance the performance and functionality of passive circuits by significantly reducing size and minimizing par...
With Moore’s Law reaching its limits, the semiconductor industry is moving towards Gate-All-Around (GAA) devices and 2.5D/3D heterogeneous integration. Key challenges include energy management, especi...
In recent years, the demand for high-performance RF packaging has increased due to the integration of multiple semiconductor dies into compact packages. Advanced manufacturing techniques now enable hi...
Packaging plays a critical role in modern microelectronic systems. With the advent of the 5th and 6th generation wireless communication standards, tight co-integration of packaging and radio-frequency...
The talk provides an overview of recent developments in microwave components realization leveraging additive and hybrid fabrication technologies. Exploitation of available three-dimensional geometry f...
The novel die-embedded glass packaging technology integrates a 140GHz InP power amplifier (PA) into a glass substrate using micro-vias for interconnects, eliminating assembly and achieving less than 1...
The use of wearable electronic devices that can acquire vital-signs from the human body noninvasively and continuously is a significant trend for healthcare. The combination of materials design and ad...
Chiplet packaging is progressing towards higher connection densities using micro-bumps and hybrid-bonding, which increase current densities and complicate power networks. Silicon interposers serve as ...
NASA’s current space astrophysics missions do not use THz technologies, but instead many are capitalizing on the developments of decades ago in visible and near-infrared detectors. This leaves opportu...
Superconducting THz detectors were first used in astronomy more than four decades ago, and fifteen years have passed since they were used very successfully on the Herschel Space Observatory. Recent te...