WMH: Transitions and Interconnects Across Dissimilar Transmission Lines

Presentation Abstract
Modern RF, mm-wave, and sub-THz systems stitch together multiple propagation media — microstrip, CPW/GCPW, SIW, ridge and rectangular waveguide, superconducting multilayers, and emerging flexible and additive platforms — because no single line technology satisfies bandwidth, loss, power, packaging, and cost targets simultaneously. This full-day workshop brings leading researchers and practitioners to present field-based design rules, validated topologies, and measurement workflows for high-performance transitions and interconnects across these media. Foundational talks cover the evolution of planar↔waveguide links and state-of-the-art SIW transitions (including compact, broadband launchers and thick–thin stackup integration). Practical sessions compare microstrip, GCPW, and SIW on a common process, detail ridge/ridge-gap waveguide connections, and treat transmission-line choices for high-speed/high-frequency ICs. Materials and manufacturing frontiers are addressed via MXenes for printable conductors, flexible hybrid electronics for ultra-low-cost modules, and multilayer superconducting devices for ultra-low-loss front-ends. A methodological block demonstrates AI/ML-assisted EM optimization (adjoint sensitivities, surrogates, active DOE) that reduces simulation burden while improving insertion/return loss and mode control. Throughout, speakers emphasize tolerance and variability, packaging and interposers, vertical/horizontal launches, and over-the-air and on-wafer verification. Attendees leave with implementable recipes and performance bounds that shorten development cycles and raise first-pass success for integrated communications, sensing/ISAC, and imaging hardware.