In this work, a suite of 35 nm InP HEMT MMIC chiplets are heterogeneously integrated on a 75 µm SiC interposer. Performance of each integrated chiplet component is demonstrated at F-Band (90 – 140 GHz...
This work presents the first additively manufactured millimeter-wave identification (mmID) platform for wearable sensing that is fully self-powered and orientation agnostic. A multilayer inkjet-printe...
For the first time, the authors propose an additively manufactured reconfigurable metalens that enables ultra-wideband operation and wide-angular coverage for adaptive mmWave front-ends. The design us...
The present paper proposes a novel packaging method for high-frequency power amplifiers such as GaN HEMTs. The aim of this method is to minimize the parasitic components effect of the interconnection ...
This paper presents a compact, fully integrated packaging-antenna solution for a programmable active STAR-RIS capable of simultaneous transmission and reflection. Through co-design of a multilayer org...
This paper presents a wideband reflection-type group delay controller (RTGDC) that achieves a large group delay range and tunable center-frequency operation using a dual-varactor reflective load. Two ...
This paper presents a continuously tunable delay line based on coupled transmission-line resonators whose resonant frequencies and coupling coefficients are controlled using BST (Barium Strontium Tita...
This paper presents a novel integrated, frequency-tunable SiGe active isolator. Its high isolation and linearity make it well-suited for communications circuits and other systems that require frequenc...
In this paper, a full duplex (FD) filtering antenna with nonreciprocal transmission characteristic, implemented by substrate integrated waveguide (SIW) integrated with the spatiotemporal modulation (S...
This paper presents detailed analysis and design of frequency tunable, all-port reflectionless nonreciprocal bandpass filter (NR-BPF) based on spatiotemporal modulation. All-port reflectionless NR-BPF...