In this talk we will present how Aerosol Jet Printing technology — a form of additive manufacturing — has evolved over the last decade to provide significant heterogeneous integration and RF packaging...
This paper reports RF performance of 2.5D Metal-Insulator-Metal CAPacitors (MIMCAPs) within a 300 mm silicon (Si) interposer. The MIMCAPs use both high-k dielectric and 3D oxide-stud patterning to sim...
In this paper, a device-circuit co-design approach for a 5.8-GHz rectifier is presented, utilizing doping-optimized quasi-vertical gallium nitride (GaN) Schottky barrier diodes (SBDs). To overcome the...
This paper presents a W-band low-noise down-conversion mixer implemented in 65-nm CMOS technology. The proposed mixer employs a switched-transconductance (SwGm) architecture with DC-decoupled RF and L...
The rapid demand for measurements at ever-higher frequencies is driving new requirements for accuracy, traceability, and integration in wafer-level test systems. With increasing circuit complexity and...
Quantum computers are nearing the thousand-qubit mark, with research and industry focusing on further scaling up to achieve computational advantage over classical computers. However, as quantum proces...