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Th3D-3: Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies
In this contribution we present characterization strategies to reduce the impact of technology process variation in square-law detectors to be used as on-wafer power calibration transfer devices. Two ...
Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
Fully differential measurements in D-band (110–170GHz) are challenging due to the absence of differential multi-port measurement equipment. This work presents a methodology to enable full differential...
Th3D-5: Cryogenic Microwave Probe Technology with High Thermal Insulation
Integration and low power consumption of cryogenic amplifiers, which are essential for reading out quantum qubits, are inevitable issues for scaling up quantum information processing systems. Although...
Th3F-1: Algorithmic Design of Nonintuitive On-Chip Multilayered Passive Networks
This paper presents various approaches to applying electromagnetic inverse design and optimization algorithms for nonintuitive passive network design in integrated circuits (ICs). The use of multiple ...
Th3F-2: A D-Band InP Power Amplifier Featuring Fully AI-Generated Passive Networks
This work presents a high-efficiency D-band power amplifier (PA) implemented in 250nm InP technology. A key innovation is the integration of artificial intelligence (AI) into the RFPA design flow for ...
Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+
Designing and optimizing passive matching networks (PMNs) is critical for high-performance RFICs. Traditional methods rely on empirical models and computationally intensive EM simulations. Recent deep...
Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
Design of RF and mmWave circuits and electromagnetic (EM) structures is typically a designer experience-driven process, aided with time and resource-intensive simulations, iterative design methods, an...
Th3F-5: On-Board Array Self-Calibration Using Amplitude-Only Proximal-Field Sensors and Machine-Learning-Based Phase Retrieval
A technique for calibrating phased arrays using on-board proximal-field amplitude sensors is introduced. Using these sensors, the phase excitation of each element in an array is estimated using local ...
Th3G-1: A C/X-Band LNA Leveraging a Voltage-Tapered Gain-Cell Stacking Technique for 6G and IR-UWB
This work details the design of a low-power LNA, fabricated in a 45nm PDSOI process, for IR-UWB and 6G satellite communication applications. This device operates in C and X-band, demonstrating superb ...
Th3G-2: An 8–12.2GHz CMOS Low-Noise Amplifier with Partially Tail-Coupled Transformer and Large-Transistor Achieving 1.8dB Average NF
This paper presents an 8–12.2 GHz low-noise amplifier (LNA) featuring a partially tail-coupled transformer and a large-transistor design to enhance noise and gain performance. The proposed partially t...