MicroApps Seminars
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Rapid identification of object from RCS signals is important for traffic control, space and defense applications. The problem is typically solved using artificial neural networks. For accurate identification big data of monostatic/bistatic RCS is required. RCS data in a dense grid of directions should be collected for plane wave excitation incoming from numerous directions in a broad frequency range. Measurements cannot be used to collect sufficient data, and even for 3D EM simulation the task is challenging. WIPL-D will demonstrate a number of new options to acquire big data of RCS using examples of interest (birds, drones, vehicles, aircraft).
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This seminar covers the critical role that RF connectors fulfill and outlines the process of proper RF connector selection from the myriads of choices that are currently available. It will include an overview of the many defined standards and why so many exist. In addition, the key elements to consider during selection will be presented in a manner that serves as a template for an ideal connector selection process.
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Designing-in high frequency RF ICs requires special attention for proper chip to substrate transitions, including RF landing patterns, substrate/pad parasitics, and solder/wire-bond profiles:
•Designers often struggle to replicate the RF IC performance on another substrate or transition then recommended, as traditional s-parameter models fail to capture the critical chip-to-substrate transitions.
•Analog Devices, introduces a new unencrypted transition-based EM model approach, “Em-Plugs”, to the industry enabling precise performance predictions across varying substrates and transitions.
•This approach predicts the s-parameters performance accurately at high frequencies up to 90 GHz while eliminating the need for multiple PCB iterations, resulting faster design cycles.
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The goals of heterogenous integration include higher speed, increased power efficiency, and smaller size. One large step towards achieving these goals is allowing high-frequency designers to co-simulate different technologies, process nodes, and/or media in a single RF-centric simulation and analysis environment. This MicroApp will introduce Cadence's new Virtuoso Studio RF platform highlighting the Virtuoso Design Link functionality to address this challenge. Designers can easily connect and integrate existing silicon and III/V designs in a single schematic for advanced RF and microwave simulation, including Method-of-Moments and Finite Element EM and thermal analysis.
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Error vector magnitude (EVM) is a key figure of merit for wireless systems. The cascaded noise and linearity of an RF signal chain can directly impact the system-level EVM performance. As a result, analyzing the EVM of an RF signal chain can provide valuable insights for optimizing system-level tradeoffs to achieve the desired performance outcomes. This presentation explores RF system-level design considerations, the relationship between system performance and EVM, the interpretation of the EVM "bathtub" curve for system optimization, and accessible tools that can be used for this analysis.
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This session highlights how RF engineers can leverage Tektronix Real-time spectrum analyzers (RSA) and SignalVu-PC software for synchronized, multi-channel RF data acquisition and analysis. Learn to connect multiple RSAs to a single PC, enabling simultaneous capture across multiple channels. Discover how this approach enhances the identification of signal interactions, interference analysis, and measurements of input/output devices like power amplifiers. Attendees will gain insights into real-time monitoring, multi-channel recording, and post-analysis workflows that reveal critical details in dynamic RF environments. Transform your spectrum analysis capabilities with unified, high-fidelity multi-channel RF capture.
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When a digitally modulated signal passes through an RF signal chain, its Error Vector Magnitude (EVM) is affected by noise, spurs and distortion. Since power management circuits generate noise and spurs, EVM can be a useful metric for assessing their quality. This Microapps talk will compare EVM results for QAM signals being amplified by RF amplifiers when those amplifiers are being powered by various power management circuits. We will focus in particular on the performance difference between LDO and Switcher based power management circuits.
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This MicroApp presents a model-based design workflow for the rapid development and prototyping of custom Orthogonal Frequency-Division Multiplexing (OFDM) modems using MATLAB, Simulink, and National Instruments (NI) USRP radios. The approach uses automated code generation from a behavioral model, and addresses challenges of efficiency and real-world applicability in wireless communication systems. By integrating simulation tools and over-the-air testing capabilities, the workflow significantly reduces the development cycle while maintaining traceability from the behavioral model to the deployed implementation. This workflow provides a seamless transition from theoretical design to practical implementation, offering insights into optimizing design and verification processes.
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RF technologies are evolving rapidly, with significant advancements such as miniaturization in Antenna in Package (AiP), enhanced QBIT fidelity for quantum computing, and deeper integration of THz technologies into AI and machine learning for network management, data processing, and decision-making. As these technologies progress from concept to fabrication to data centers, ensuring reliability at ultra-low temperatures, reducing costs, and improving power consumption and efficiency are crucial for successful market deployment. Wafer-level testing is becoming increasingly critical in achieving these goals. This keynote will explore the intersection of wafer-level testing and its essential role in advancing RF technologies for 6G, AI, and quantum computing.
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Differential designs are commonplace in the industry, for reasons including odd-order harmonic cancellation, good emissions performance, tolerance of process variance, and larger swing even on low-voltage processes. However, the factors which make tightly coupled differential designs attractive for the designer also make the acquisition of accurate S-parameter data challenging, due to incompatibility with the uncoupled representation assumed by conventional calibration algorithms. An approach to use the symmetry of the problem to ameliorate this has been proposed, and is now available in a commercial calibration package. This implementation is described, and the benefits arising from it discussed with real examples.
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The USRP SDR radios from National Instruments (NI) are not calibrated devices, and as such, they operate using relative power levels in dBFS. However, it is possible to manually calibrate the USRP and obtain absolute power levels in dBm. By enabling absolute power measurements in dBm, results can more easily be compared, interpreted, and leveraged for signal analysis and device testing. We will present the manual calibration process in detail and explain how to achieve precise and reliable signal measurements in dBm using USRP devices and associated software tools.
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Signal purity is vital for precision frequency control and timing, enabling high performance in mission-critical RF and microwave systems. This presentation examines Quantic Wenzel's method of achieving signal purity at every level, from the crystal to integrated microwave assembly. By leveraging Chip Scale Atomic Clocks (CSAC), Oven-Controlled Crystal Oscillators (OCXO), Dielectric Resonator Oscillators (DRO), Phase-Locked Loops (PLL), Microcontrollers, Field-Programmable Gate Array (FPGA) technologies, and more, Quantic Wenzel delivers solutions that reduce phase noise and enhance system performance. Attendees will learn about the advantages of integrating these technologies, real-world applications, and how Quantic Wenzel leads in frequency control and timing innovation.
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Modeling and simulation of antennas, arrays, and RF front-ends are crucial for successful wireless systems in communications and sensing. A top-down system-level approach, flexible in using full-wave EM models, behavioral models, and measured data, enhances RF system design. The goal is to make this approach accessible to engineers of all experience levels, enabling them to derive meaningful insights. This microapp showcases such a modeling paradigm. It features the use of an extensive component catalog for describing RF front-ends, with streamlined workflow for analysis and simulation, and enabling modeling options that weave in MATLAB-based scripting workflows into Simulink circuit-envelope based simulations.
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New RF buffers have noiseless delays that can achieve 0.5 ps steps and up to 50 ps range. With such delays one can tune out mismatches due to board imperfections, cable/connector mismatches, and other factors. Phase array radar systems
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Traditional oscilloscopes, while powerful, are often limited by identical settings across all channels, restricting their utility in advanced RF analysis. With the latest advancements, we have unlocked the potential of oscilloscopes to serve as wideband, multi-channel signal analyzers with truly independent configurations per channel, including center frequency, span, RBW, and time gating and almost every setting possible. This breakthrough allows users to analyze complex, multi-signal environments more effectively, enhancing diagnostic capabilities. Join us to explore this unique solution, its implementation, and the value it offers.
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Low pass filters are crucial for eliminating unwanted high-frequency signals in communication systems. Achieving enhanced far-band rejection while maintaining a compact design, however, remains a significant challenge. This presentation explores a practical tuning technique to enhance the far-band rejection capabilities of suspended substrate low pass filters. Despite the wideband nature of suspended substrate technology in general, achieving far-band rejection performance can be challenging due to the limitations inherent to transmission lines for wider frequency ranges. The tuning technique discussed aims to address these limitations, ultimately giving designers a practical option to extend far-band rejection performance in low pass filters.
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LTCC filters have traditionally delivered around 30 dB of stopband rejection. Mini-Circuits has innovated LTCC technology to produce filter designs with rejection up to 90 dB and beyond. These high-rejection designs require a launch from a stripline PCB to achieve their full rejection performance but may be adapted for other types of substrates. This presentation introduces an interposer board that allows universal adaptation of high-rejection LTCC filters for mounting onto microstrip and coplanar waveguide traces. Implementations on various substrates are presented and their performance compared with the stripline use case, demonstrating significant performance benefits compared to other filter technologies.