Your search produced 7 results
Wireless communication in the D-band inevitably needs beamforming to obtain a decent link budget. While fully digital beamforming yields too much overhead in power and area, analog beamforming, at lea...
… This talk focuses on imec’s 300mm RF Silicon Interposer packaging technology for mm-wave applications. Key modules of the technology will be …
PL2: ISTP/RFIC/IMS: RFIC Innovation: Has the Field Stalled or Are Researchers Losing Their Way?
IMS2025
The past few years have arguably seen a decrease in transformational or disruptive discoveries reported in radio-frequency integrated circuits (RFIC) papers and publications. Does this indicate that R...
WMG: GaN/Si: an Enabler for FR3 Applications?
IMS2025
GaN HEMT technology plays a crucial role in wireless telecom infrastructure for 3G, 4G, and 5G standards. Thanks to its excellent transport properties, GaN HEMTs support highly efficient, high-power o...
Frequency Modulated Continuous Wave (FMCW) radar sensors are widely used in applications such as automotive radar, indoor localization, industrial sensing, and imaging. At the heart of these sensors l...
… This talk focuses on the integration of InP Power Amplifier chiplets onto imec’s 300mm RF silicon interposer technology. Combining high frequency InP transistors with a RF optimized silicon …
IWTU1: Addressing Next Generation Intelligent Wireless Connectivity using Emerging Materials and Technology Solutions
IMS2025
The next generation of wireless connectivity network will incorporate increasing intelligence to efficiently and reliably address emerging applications like XR, teleporting, low latency links for and ...