Sun
7
Sun 7 Jun | 08:00 - 11:50
Room 256
DetailsRFICRFTT
Workshop
Abstract
Distributed Amplifier (DA) architectures have long been valued for their ability to deliver exceptionally wide bandwidths. In recent years, new design strategies and circuit techniques in various technologies have dramatically expanded their potential in applications ranging from high-speed optical and wireless communication to defense, instrumentation, radar, and sensing. This workshop will provide a comprehensive overview of recent research and development in distributed amplifiers, focusing on performance improvements across bandwidth, output power, linearity, noise, and efficiency enhancement. Emphasis will be given to implementations across multiple technology platforms including CMOS, SiGe BiCMOS, GaN, and InP technologies, highlighting the unique opportunities and challenges in each domain.
Sun
7
Sun 7 Jun | 08:00 - 17:20
Room 153AB
DetailsRFTTRFSA
Workshop
Abstract
Generative AI and Large Language Models (LLMs) are beginning to change how electromagnetic and RF systems are specified, synthesized, and verified. Although these tools are common in software and data science, their use in microwave engineering is nascent and requires careful, physics-aware evaluation. This full-day workshop spotlights state-of-the-art methods that connect AI generation to EM reality, moving beyond proofs-of-concept toward validated models and workflows engineers can use today. Technical content centers on three pillars — (1) Inverse EM / spec-to-layout and end-to-end design: “Generative AI Methods for Wireless Propagation Prediction” (Costas Sarris) shows diffusion and GANs for real-time, generalizable indoor propagation maps and super-resolution; “AI-enabled End-to-End RF and RFIC Design” (Kaushik Sengupta) discusses inverse-design and generative AI approaches for automated synthesis of complex RF passives, multi-port elements, antennas, and spec-to-GDS RFIC flows combining reinforcement learning and inverse design; “Empowering Optimal Design of RF Devices by Generative AI” (Dominique Baillargeat and Francisco Chinesta) introduces rank-reduction autoencoders as generative surrogates for RF circuits and antennas; “An Autonomous Agentic Framework for Deep Inverse Photonic Design” (Willie Padilla) presents an agentic, autonomous inverse-design workflow for metamaterials, illustrating how AI agents can accelerate spectrum-to-structure design paradigms relevant across EM domains — (2) LLM-augmented EDA workflows and ML foundations: “Practical Considerations for Applying AI to RF and Microwave EDA Workflows” (Matthew Ozalas) and “Accelerating Innovation: AI-Driven Advances in Sigrity, Clarity, and Optimality” (Jian Liu) highlight Keysight’s and Cadence’s strategies for GenAI/LLM-aided design; Complementary talks cover attention mechanisms for non-linear circuit modeling (Qi-Jun Zhang) and multiphysics-informed, data-free ML for RFIC design (Dan Jiao) — (3) Multimodal LLMs: “Multimodal LLMs for Electromagnetic Waves” (Zhi Jackie Yao) fuses image-based EM data with text via a BLIP bridge into pretrained LLMs for EM reasoning and design assistance. Rigor and trust will be discussed throughout. Talks and discussion will cover dataset curation, generalization, solver-in-the-loop constraints (passivity/causality/manufacturability), independent EM/measurement validation, and secure integration into EDA flows, along with practical guardrails to avoid hallucinations and constraint violations. For attendees new to this intersection, the workshop includes short primers, reproducible examples, and simple evaluation checklists to separate signal from hype.
Sun
7
Sun 7 Jun | 08:00 - 17:20
Room 156C
DetailsRFTT
Workshop
Abstract
The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies, from mm-wave to sub-THz bands. The flexibility required from these systems to support multiple functionalities leads to the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing performance and functional density while reducing the size and cost of next-generation RF systems. However, the shift to 3DHI also introduces a new set of challenges, ranging from novel processes and substrates to RFIC/MMIC design, packaging and thermal management. This workshop brings together leading experts from academia and industry to present the latest advances and design methodologies in heterogeneous integration and advanced packaging technologies for mm-wave and sub-THz applications. The talks span a wide range of critical topics, including interposer-based system integration, advanced simulation techniques, integration of III-V technologies, SiGe and CMOS platform optimization, and co-packaged system testing and calibration.
Sun
7
Sun 7 Jun | 08:00 - 17:20
Room 157AB
DetailsRFTTRFSA
Workshop
Abstract
The rapid progress in quantum computing has made microwave engineering a key enabler of nearly all major hardware platforms, including superconducting qubits, spin qubits, trapped ions, etc. Each of these technologies relies on advanced microwave techniques for control, coupling, readout, and scaling, demanding approaches that go well beyond classical electromagnetics. This creates a great opportunity for microwave engineers to make lasting contributions to the development of quantum computing and related technologies. The need for ultra-low-noise amplification, high-fidelity readout, and crosstalk suppression has stimulated novel device designs, often requiring hybrid approaches that combine electromagnetic modeling with quantum theory. Similar challenges appear in other quantum platforms; for example, trapped-ion processors demand stable and phase-coherent microwave delivery for multi-qubit gates, while spin qubits rely on advanced microwave control schemes. At the algorithmic level, quantum computing is increasingly viewed as a potential game-changer for electromagnetics and related fields. Specialized quantum algorithms promise significant acceleration for tasks such as solving integral equations, optimizing antenna radiation patterns, or addressing NP-hard problems in inverse scattering and system design. While fully fault-tolerant quantum computing remains a long-term goal, near-term noisy intermediate-scale quantum devices are already serving as valuable testbeds. Hardware-aware algorithm design, ie tailoring quantum algorithms to the specific strengths and limitations of physical devices, is becoming an essential strategy for identifying useful applications in the presence of noise and limited coherence times. This workshop will highlight state-of-the-art advances at the interface of microwave engineering, quantum hardware development, and quantum algorithm design. Contributions will cover multiple quantum platforms, emphasizing both their unique microwave engineering challenges and the unifying principles that connect them. A particular focus will be placed on industrial perspectives, including scalability, reliability, and manufacturability of microwave components for large-scale quantum systems. Industry engagement is crucial, as commercial interest and investment in quantum computing have surged dramatically, creating demand for engineers who can translate fundamental concepts into deployable technologies. To ensure accessibility, the workshop will open with a comprehensive tutorial introducing the basics of quantum theory in the language of microwave engineering. This will help participants from the RF and microwave community engage with the specialized concepts of quantum physics and better appreciate their role in quantum device design. The program will then feature a series of invited talks from leading experts in academia and industry, with topics spanning theoretical methods, quantum hardware, and algorithmic perspectives. By bringing together specialists from diverse quantum hardware platforms, algorithm developers, and industrial leaders, this workshop will provide a unique forum for exchanging ideas, identifying cross-platform synergies, and further drafting the engineering roadmap toward practical, scalable quantum computing.
Sun
7
Sun 7 Jun | 08:00 - 17:20
Room 157C
DetailsRFTTARFTG
Workshop
Abstract
With the operating frequencies of 6G wireless communications and next-generation automotive radars extending above 110GHz, accurate and robust on-wafer measurements are essential for enabling design, model verification, and industrialization. While a solid foundation has been established over the past decades in calibration methodologies and measurement platforms, many challenges remain as research and development move deeper into the sub-THz domain. As advanced devices, circuits, interposers/packaging technologies emerge alongside high-frequency systems, new measurement scenarios and calibration requirements continue to arise. At the same time, new methodologies such as AI-driven automation, advanced calibration algorithms, and novel calibration substrates are being developed to address these evolving needs. This full-day workshop brings together international experts from national metrology institutes, academia, and industry to address these challenges from complementary perspectives. The program begins with a focus on the fundamentals of calibration and measurement, reviewing the state-of-the-art in instrumentation, calibration techniques, and traceability at mm-wave frequencies, followed by comprehensive design guidance for calibration standards and systematic analysis of probe-induced uncertainties. These sessions lay the foundation for reliable and reproducible on-wafer measurements at sub-THz frequencies, offering both the theoretical framework and practical guidance needed for advancing calibration practices. The workshop then transitions to next-generation tools and methodologies that are extending the state-of-the-art. Topics include AI-driven nano-robotic probe stations that achieve sub-micron alignment and reproducible probe placement, calibration algorithms that go beyond conventional error models to capture mode conversion and crosstalk, and the development of GaAs impedance standard substrates supporting diverse calibration standards and measurement scenarios. Recent advances in broadband vector network analyzer technology will also be presented, including single-sweep measurements up to 250GHz and new calibration capabilities. These contributions demonstrate how innovative approaches are being translated into practical platforms, enhancing both robustness and scalability. Finally, the workshop highlights applications and industrial implementations. Talks will show how advanced calibration and measurement techniques are applied in wafer-scale silicon interposer technologies — addressing stackup choices, GSG pad design, and multimode suppression — as well as in high-volume silicon device testing for next-generation components. Presentations from industrial experts will emphasize optimizing calibration substrates, comparing methodologies such as modal versus SOLR calibration, and reducing measurement uncertainties under real manufacturing constraints. Together, these examples illustrate how academic innovation and industrial practice are converging to enable accurate and traceable measurements at scale. By covering the full spectrum from fundamentals to industrialization, this workshop offers participants both foundational insights and exposure to cutting-edge solutions. The day will conclude with an open discussion, providing a forum to exchange ideas, identify open challenges, and shape the roadmap for accurate, scalable, and robust on-wafer sub-THz measurements.
Sun
7
Sun 7 Jun | 08:00 - 17:20
Room 254AB
DetailsRFICRFTT
Workshop
Abstract
Increasing demand for continuous information flow and uninterrupted connectivity requires next-generation communication and sensing systems to support higher data-rates and wideband operation. As a result, wireless systems are moving to higher frequencies, offering wider bandwidth and higher channel capacity, while simultaneously reducing the system size. Although lower mm-wave bands, such as V-band (40–75GHz), have been explored as a potential solution to meet the demand for high-speed connectivity, the elevated levels of atmospheric attenuation create an additional challenge for maintaining signal power in wireless transmission over long distances. On the other hand, the upper portion of the mm-wave spectrum at 110–300GHz, also known as G-band, offers a promising path to achieve higher data-rates in point-to-point links, defense applications, localization, ranging, and other multi-user communication scenarios as the underutilized portion of the EM spectrum, while enabling higher resolution in radars and other sensing systems for biomedical or security screening and also reducing the size of all these systems. The sub-THz spectrum above 200GHz is of particular interest due to lower atmospheric attenuation. However, building high-performance integrated circuits and systems at G-band poses significant disadvantages due to the lower available gain of the transistors and higher noise contribution from components, leading to higher power consumption and reduced sensitivity at these sub-THz frequencies. Therefore, a combination of advanced circuit design techniques and system-level innovations, state-of-the-art high-speed devices harnessing the properties of compound semiconductors, heterogeneous integration, and co-design with packaging is essential to overcome the inherent challenges of the G-band design space. This workshop provides a comprehensive and in-depth review of the latest academic and industrial research on innovative techniques and cutting-edge technologies for realizing high-data-rate wireless communication and radar systems at 110–300GHz across SiGe, scaled-CMOS, InP, and GaN platforms, with particular focus on designs above 200GHz in the upper G-band. First, novel circuit techniques and topologies to enable high-power generation with maximum power efficiency, advanced high-speed device design and optimization in compound semiconductor processes, as well as III-V RF front-ends and hybrid InP/CMOS phased arrays above 200GHz, will be presented. State-of-the-art SiGe BiCMOS transceiver arrays across the entire G-band will be showcased with an emphasis on ultra-compact design and 2D scalability, along with multiple demonstrations of modular beamforming ICs supporting up to 200Gbps wireless transmission, wideband radar transceiver chips for integration in large MIMO arrays, and upper G-band MMICs enabling radar systems with multi-target resolution down to a few millimeters while maintaining an absolute ranging accuracy on the order of 1µm. In addition, system- and circuit-level design considerations for record-low-power CMOS radar sensor systems will be reviewed. Finally, co-design and co-integration of sub-THz ICs in SiGe and SOI with glass interposer technology and 3-D Heterogeneous Integrated (3DHI) phased arrays incorporating an antenna on glass, GaN-on-SiC MMICs, a silicon interposer, and a silicon Beam Forming Integrated Circuit (BFIC) will be presented as a pathway toward end-to-end communication modules in G-band for commercial and defense applications.
Mon
8
Mon 8 Jun | 08:00 - 11:50
Room 157C
DetailsRFTTRFICRFSA
Workshop
Abstract
The exponential demands for higher power densities, broader frequency coverage, and enhanced reliability in microwave systems have exposed fundamental limitations in conventional thermal design approaches. As next-generation applications push beyond traditional thermal boundaries — from 5G/6G infrastructure to automotive radar and space-based communications — the industry faces a critical inflection point where incremental improvements in thermal management are essential to meet performance requirements. This workshop addresses these challenges through a comprehensive exploration of advanced thermal characterization, materials innovation, and holistic design methodologies that span from fundamental materials science to industrial-scale implementation. The program brings together leading researchers, and industry practitioners to present breakthrough approaches that are reshaping thermal management across the RF and microwave ecosystem. The technical foundation begins with the innovations in wide-bandgap materials presented by Prof. Srabanti Chowdhury of Stanford University, whose pioneering work on ultra-wide bandgap materials demonstrates how diamond integration with Beta-Gallium Oxide enables unprecedented reduction in thermal boundary resistance while maintaining RF performance. These materials advances provide the essential building blocks for next-generation thermal management solutions, particularly in high-power RF applications where conventional thermal interface materials reach fundamental limitations. Oscar D. Restrepo offers industrial thermal modeling and characterization perspectives from GlobalFoundries, where a unique combination of theoretical expertise in phonon transport and practical TCAD thermal simulation experience bridges fundamental physics with manufacturing-scale implementation. His work spans from first-principles calculations of defect formation energies to real-world thermal assessments across advanced technology nodes, including 22FDX and 12LP platforms. Building upon materials foundations, the workshop explores state-of-the-art thermal characterization techniques through both academic research and commercial implementation. Advanced thermoreflectance imaging, POSH-TDTR technology, and emerging measurement approaches demonstrate how nanosecond temporal resolution combined with submicron spatial accuracy reveals previously inaccessible thermal phenomena in operating RF devices. These characterization advances enable predictive thermal design that was previously impossible with conventional measurement techniques. Standards and validation methodologies receive dedicated attention through participation by the National Institute of Standards and Technology (NIST), which presents traceable thermal measurement techniques and validation protocols essential for industry adoption. NIST’s gate resistance thermometry methods and RF power metering standards provide the measurement foundation necessary for reliable thermal characterization across different technology platforms. The workshop culminates in a holistic design philosophy that integrates materials innovation, advanced characterization, and system-level optimization. Live demonstrations showcase how this integrated approach enables thermal-electromagnetic co-design, abandoning traditional component-level optimization in favor of system-wide performance optimization. Real-world case studies span from mm-wave antenna-in-package modules to high-power GaN amplifiers, illustrating a direct correlation between materials properties, thermal imaging data, and system performance. Interactive sessions throughout the workshop foster direct dialogue between materials researchers, device designers, and manufacturing engineers. These discussions address practical implementation challenges while exploring emerging opportunities that could reshape thermal management approaches over the next decade. The format emphasizes knowledge transfer and collaborative problem-solving rather than traditional presentation-only formats.
Mon
8
Mon 8 Jun | 08:00 - 11:50
Room 155
DetailsRFSARFTT
Workshop
Abstract
In recent years tremendous advances have been made in electronics and photonics device technologies for the generation, modulation, radiation, and detection of THz signals and the time is now right to exploit these advances to build and deploy THz systems. IEEE defines the THz band as frequencies ranging from 300 to 3000GHz, however, for most use cases frequencies extending from about 100GHz to 10THz is considered as the sub-THz and THz bands. The focus of this workshop is on the research and development of components and systems for THz wireless communications and sensing. In the THz band, the available bandwidth is very vast, and this feature can be leveraged for multi-Gbps wireless communications leading to terabits per second throughput in a multi-channel system. Besides communications, THz waves can be used for sensing the reflection, transmission, absorption, and scattering of materials which in turn can be exploited for detecting, imaging, and analyzing materials with high spectral resolution. Furthermore, the wavelength of THz waves is small and on the order of 30 microns to 3.0mm, which along with polarization of the signal can be exploited for precise position and orientation of objects, within a specific location. All the above features are crucial for 6G communications, self-driving vehicles, and industrial Internet-of-Things. Accordingly, the workshop includes presentations from individuals and organizations across the globe highlighting the THz components and systems that they have developed and their application to communications and sensing.
Mon
8
Mon 8 Jun | 08:00 - 11:50
Room 256
DetailsRFTTRFSAARFTG
Workshop
Abstract
In RF device characterization, understanding and utilizing phase information is crucial for achieving accurate measurements. This workshop is designed for engineers, technicians, and researchers who seek to deepen their knowledge of phase references and their applications in vector network analyzers (VNAs) and vector signal analyzers/generators (VSAs/VSGs). The primary goal of this workshop is to emphasize the significance of phase information in RF measurements. We introduce the concept of a “signal comb” as a phase reference and a tool for enhancing measurement accuracy. Participants will gain insights into how a comb generator works and how phase references can improve the reliability of amplitude and phase measurements across various RF applications. Key Topic #1 — Understanding Phase Information: • Introduction to phase information and its relevance in RF measurements; • Discussion of the limitations of traditional amplitude measurements and the often-overlooked phase references. Key Topic #2 — The Role of Signal Comb: • Explanation of what a signal comb is and its function in RF testing; • How a signal comb acts as a “Swiss army knife” for calibration and broadband verification; • Design overview of a comb generator and its traceability. Key Topic #3 — Benefits of Phase References: • Detailed exploration of how aligning VNAs and VSAs/VSGs to a known phase reference enhances measurement accuracy; • The importance of traceable calibration for establishing transfer standards in amplitude and phase uncertainties. Key Topic #4 — Practical Applications: • Hands-on examples demonstrating the application of phase calibration in real-world scenarios; • Case studies including time domain transformation and frequency-converting circuit measurements. Key Topic #5 — Advanced Measurement Techniques: • Techniques for aligning multi-port VSAs in amplitude, phase, and time using phase references; • Over-the-air measurement of group delay in low-noise block downconverters (LNBs) and pulse response determination of amplifiers at optimized operating points. Who Should Attend — This workshop is ideal for RF engineers, measurement technicians, and researchers involved in RF device characterization and testing. Whether you are a seasoned professional or new to the field, this workshop will provide valuable insights and practical skills to enhance your measurement capabilities. Format — The workshop will feature a combination of presentations, interactive discussions, and hands-on demonstrations. Participants will have the opportunity to engage with experts in the field and collaborate with peers to solve measurement challenges. Join us for this comprehensive workshop to unlock the full potential of phase information in your RF measurements. By the end of the session, you will have a solid understanding of phase references, the utility of signal combs, and advanced measurement techniques that can save you time and improve the accuracy of your RF testing endeavors. Don’t miss this opportunity to elevate your measurement skills and ensure precision in your RF applications.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 152
DetailsRFTT
Workshop
Abstract
RF Power Amplifiers (PAs) play a critical role in modern wireless and satellite communications, radar, and electronic systems, requiring a deep understanding of both fundamental principles and cutting-edge innovations. This advanced course is designed for PhD students and professional researchers seeking to expand their expertise in RF PAs design, analysis, and optimization. Starting from solid-state power amplifiers fundamentals, the course will cover theoretical concepts, including PA classes of operation, their Figures of Merit, stability considerations and efficiency enhancement techniques. Special emphasis will be placed on advanced PA architectures, including Doherty PA, Envelope Tracking and other PA architectures, which are critical for next-generation wireless and satellite communication systems. The course will also address broadband design challenges and emerging trends in integrated PAs for large-scale phased array applications. Linearization strategies, including digital predistortion (DPD), will be discussed as essential tools to mitigate distortion and improve spectral efficiency. Several design examples based on commonly used semiconductor technologies (eg GaN, GaAs etc) will be presented to highlight the link between theory and practical implementation. Through a combination of theoretical foundations, practical case studies, and research-driven discussions, attendees will gain the expertise needed to design, model, and optimize cutting-edge RF power amplifiers. By the end of the course, participants will be well-equipped to contribute to breakthrough innovations in PA technology, bridging the gap between academic research and industrial applications.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 153AB
DetailsRFTT
Workshop
Abstract
Low-noise receivers are crucial system components for Earth observation and satellite communication. The complexity of such systems is growing, where today’s spacecraft range from large satellite missions such as MetOp-SG, to smaller systems such as the Arctic Weather Satellite, to CubeSats such as TROPICS (Time-Resolved Observations of Precipitation structure and storm Intensity with a Constellation of Smallsats). One of the most important building blocks are low-noise amplifiers. Over the years, corresponding technologies have improved substantially and provided excellent noise temperatures. Furthermore, the linearity and robustness of receivers is also an important characteristic, which adds another level of complexity. This requires new technologies, such as GaN HEMTs, with the necessity of different system architectures. This workshop gives an overview of the design of low-noise amplifiers and corresponding technologies. Furthermore, several aspects of the design and performance of receiver architectures will be discussed. Rarely discussed topics, such as in-system calibration targets or the reliability testing of critical components, will also be presented. The workshop starts with aspects of low-noise receiver systems and gives examples of several satellite missions and a background to the topic. Subsequently, best practices for the design of low-noise amplifiers and receivers are presented. An overview of recent advances in low-noise transistor technologies and the reliability testing is included as well. The remaining talks focus on different possibilities of low-noise calibration approaches for satellite systems.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 153C
DetailsRFTTRFSA
Workshop
Abstract
This workshop surveys a materials-to-systems roadmap for reconfigurable apertures spanning sub-6GHz, FR3 (≈7–24GHz), mm-wave, and THz. Highlights include dual-polarized RFSOI-switched reflectarrays at 3–6GHz and 13–15GHz with true-time-delay or ultra-short phase shifters, achieving ±60° all-plane scanning and <1.5% EVM with 64-QAM. A 28GHz origami “eggbox” phased array merges electronic beam steering with controlled shape morphing to deliver near-360° azimuth coverage, multibeam and quasi-isotropic patterns, and additively manufactured foldable interconnects with ∼0.02dB/mm insertion loss. At higher frequencies, phase-transition and phase-change materials (VO₂, W:VO₂, GeTe) enable optically addressable, nonvolatile metasurfaces for broadband modulation, beam control, and tunable lensing in the sub-THz/THz regime, while plasmonic-nanoantenna platforms yield compact, high-SNR THz spectroscopy and imaging for sensing and security. CMOS-integrated, tile-scalable programmable metasurfaces and RIS architectures support resilient links and massive MIMO; electromagnetically consistent models and optimization frameworks extend to holographic surfaces and near-field ISAC. New multi-beam transmissive/reflective surface architectures up to 140GHz, OTA calibration and range-reduction methods for large reconfigurable arrays, and binary-coded genetic optimization of pixelated multiband antennas complete the program. Collectively, the sessions chart a path to low-loss, wide-angle, and highly programmable apertures that unify communications, sensing, and localization while remaining manufacturable, scalable, and verifiable.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 154
DetailsRFTTRFSA
Workshop
Abstract
Superconducting qubits have emerged as a leading platform for scalable quantum computing, offering robustness, manufacturability, and seamless integration with microwave engineering techniques. This workshop presents a comprehensive journey from the foundational principles of superconducting quantum systems to advanced microwave design strategies that enable scalable architectures. We begin by exploring the physics of Josephson junctions — the non-linear inductive elements that form artificial atoms — and their integration into quantum circuits. Participants will gain insights into the design and simulation of qubit-resonator networks, quantum amplifiers, and cryogenic microwave systems operating within dilution refrigerators at millikelvin temperatures. Key engineering challenges will be addressed, including resonance frequency tuning, qubit-resonator coupling, and quantum parameter optimization (eg anharmonicities, cross-Kerr effects). The workshop will also examine the role of quantum amplifiers in enhancing readout fidelity and the importance of scalable microwave layouts for multi-qubit systems. Using real-world examples and simulation workflows, we will demonstrate how to accelerate development cycles and improve design accuracy. Attendees will leave with a clear understanding of how microwave engineering principles intersect with quantum hardware design, paving the way for scalable quantum computing architecture.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 156AB
DetailsRFTT
Workshop
Abstract
Digital manufacturing technologies are transforming RF design, packaging, and integration, leading to new capabilities and use cases for high-frequency RF components and systems. The potential to digitally manufacture RF components, alongside new materials and integration processes, offers unprecedented opportunities for improving performance, reducing size/weight, and enhancing sustainability across the lifecycle of microwave systems. However, significant challenges remain in design, the realization of digitally-processed materials and manufacturing methods, and the seamless integration of individual components to full RF systems. This workshop aims to bring together advanced RF component design methodologies, manufacturing techniques, and practical RF/microwave applications. It will provide a comprehensive overview of new design, integration, and packaging techniques for microwave, mm-wave, and THz RF systems. Specifically, the workshop will give a detailed overview of novel materials, sustainable manufacturing methods, and scalable integration schemes that facilitate the realization of high-performing, highly-functional, and highly-miniaturized RF components. The workshop will bring forward recent advances in these fields by presenting the research of leading researchers and industry experts in the fields of RF component development, digital additive manufacturing, multi-material integration, and microwave materials engineering. Discussions will include cross-disciplinary advances involving manufacturing technologies, material development, and new design methods (ie design-for-print), opening new directions for materials-enabled innovation in wireless communication, sensing, and high-frequency electronics.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 156C
DetailsRFTT
Workshop
Abstract
Phase-Change Material (PCM) RF switches are emerging as a breakthrough technology for reconfigurable microwave and mm-wave circuits. With their non-volatile operation, low insertion loss, and high power-handling capability, PCM switches offer distinct advantages over conventional alternatives. These properties make them ideal for use in phase shifters, impedance tuners, reconfigurable filters and switchable antenna arrays. At mm-wave frequencies, their scalability and fast response unlock new possibilities in adaptive beamforming, dynamic spectrum access, and next-generation 5G/6G wireless, satellite, and radar systems. This workshop will bring together leading experts from industry and academia worldwide to present recent advances and future directions in PCM-based RF technologies including coverage of device concepts, circuit integration, and application case studies. It aims to foster cross-disciplinary dialogue and broaden the community’s understanding of this promising technology for future mm-wave communication platforms.
Mon
8
Mon 8 Jun | 08:00 - 17:20
Room 157AB
DetailsRFTT
Workshop
Abstract
Modern RF, mm-wave, and sub-THz systems stitch together multiple propagation media — microstrip, CPW/GCPW, SIW, ridge and rectangular waveguide, superconducting multilayers, and emerging flexible and additive platforms — because no single line technology satisfies bandwidth, loss, power, packaging, and cost targets simultaneously. This full-day workshop brings leading researchers and practitioners to present field-based design rules, validated topologies, and measurement workflows for high-performance transitions and interconnects across these media. Foundational talks cover the evolution of planar↔waveguide links and state-of-the-art SIW transitions (including compact, broadband launchers and thick–thin stackup integration). Practical sessions compare microstrip, GCPW, and SIW on a common process, detail ridge/ridge-gap waveguide connections, and treat transmission-line choices for high-speed/high-frequency ICs. Materials and manufacturing frontiers are addressed via MXenes for printable conductors, flexible hybrid electronics for ultra-low-cost modules, and multilayer superconducting devices for ultra-low-loss front-ends. A methodological block demonstrates AI/ML-assisted EM optimization (adjoint sensitivities, surrogates, active DOE) that reduces simulation burden while improving insertion/return loss and mode control. Throughout, speakers emphasize tolerance and variability, packaging and interposers, vertical/horizontal launches, and over-the-air and on-wafer verification. Attendees leave with implementable recipes and performance bounds that shorten development cycles and raise first-pass success for integrated communications, sensing/ISAC, and imaging hardware.
Mon
8
Mon 8 Jun | 13:30 - 17:20
Room 256
DetailsRFTT
Workshop
Abstract
Power Amplifiers (PAs) are key elements in every communication link, and their performance strongly impacts a system’s data throughput, power consumption, size, and reliability. With the transition from a small number of GEO satellites to large-scale constellations in LEO and MEO, driven by commercial and defence applications, there is increasing pressure to rethink PA architectures. Efficiency, bandwidth, and linearity remain central figures of merit, but the trade-offs between them acquire new dimensions in the context of satellite communications, where cost per bit, scalability, and long-term reliability are critical. This workshop will bring together perspectives from MMIC designers and system engineers to explore how solid-state PAs are evolving to meet these demands. Presentations will cover advances in GaN technology, thermal and reliability challenges, efficiency enhancement techniques, and integration. Looking ahead, the workshop will also highlight areas where new approaches could shift the current landscape: highly integrated front-end modules, thermal management, and new characterisation methods for devices at mm-wave and sub-THz frequencies. The intended outcome is to provide participants with a snapshot of current best practices and a clear view of the open challenges that will define the next steps in SATCOM PA research.
Tue
9
Tue 9 Jun | 10:10 - 11:50
Room 151AB
DetailsRFTT
Technical Sessions
Abstract
This session opens with an invited keynote talk that sets the stage for the technical contributions that follow. The subsequent papers highlight recent advances in acoustic resonator and filter technologies targeting highly integrated and reconfigurable RF front-ends. Topics include bi-layer A3-mode acoustic resonators operating at 18GHz with a near-zero Temperature Coefficient of Frequency (TCF) and high electromechanical coupling, IDT-based mm-wave resonators with large impedance ratios and wide frequency offsets, and miniature reconfigurable acoustic RF couplers. Further contributions address arbitrarily configurable group-delay in acoustic devices and the generalized synthesis of double-ladder acoustic filters, including the demonstration of a high-performance dual-band duplexer on LTOI using a hybrid BAW-assisted wideband bandpass topology.
Tue
9
Tue 9 Jun | 10:10 - 11:50
Room 153AB
DetailsRFTT
Technical Sessions
Abstract
This session presents the latest advances in phase-shifter and true-time-delay circuits. The research spans a diverse range of implementations, from 3D-printed structures to integrated on-chip designs in GaAs, SiGe, and CMOS technologies, including a novel approach utilizing on-chip phase-change materials (PCM). The featured works cover a broad frequency spectrum, spanning from 3GHz up to 150GHz.
Tue
9
Tue 9 Jun | 12:00 - 13:30
Room 156C
DetailsRFTTRFSA
Panel Session
Abstract
Recent advances in artificial intelligence (AI) and machine learning (ML) are transforming the way wireless components and complex electromagnetic (EM) systems are conceived, designed, and deployed. This session explores how ML-enabled optimization techniques are redefining applied electromagnetics, spanning the full pipeline from computational electromagnetics (CEM), uncertainty quantification (UQ), and antenna design to impactful applications such as magnetic resonance imaging (MRI), orthopaedic diagnostics, and remote sensing of snow and environmental parameters. By embedding AI and ML into EM modeling and optimization workflows, engineers can accelerate design cycles, navigate high-dimensional design spaces, and achieve performance levels that are difficult to reach with conventional approaches.
Beyond algorithms, the session emphasizes the critical role of data in driving the quality, robustness, and trustworthiness of AI-based solutions. High-fidelity simulation data, measurement-driven datasets, and hybrid physics-informed approaches are discussed as essential enablers for reliable learning and generalization. Attention is also given to the challenge of bridging ambition and deployment—moving AI-enhanced EM techniques from proof-of-concept demonstrations to deployable, validated systems operating under real-world constraints.
Beyond algorithms, the session emphasizes the critical role of data in driving the quality, robustness, and trustworthiness of AI-based solutions. High-fidelity simulation data, measurement-driven datasets, and hybrid physics-informed approaches are discussed as essential enablers for reliable learning and generalization. Attention is also given to the challenge of bridging ambition and deployment—moving AI-enhanced EM techniques from proof-of-concept demonstrations to deployable, validated systems operating under real-world constraints.
Tue
9
Tue 9 Jun | 13:30 - 15:10
Room 151AB
DetailsRFTT
Technical Sessions
Abstract
This session highlights advanced mm-wave oscillators, upconverters, frequency multipliers, and mixers implemented in CMOS, SiGe, and GaN technologies. The presented integrated circuits achieve broadband operation, low phase noise, high output power, and high conversion gain over frequencies spanning 30GHz to 300GHz.
Tue
9
Tue 9 Jun | 13:30 - 15:10
Room 153AB
DetailsRFTT
Technical Sessions
Abstract
This session presents recent advances in computational techniques, including machine-learning-enabled methods for microwave applications, with a focus on accelerating full-wave analysis and design. Contributions include rapid synthesis of training data for deep-learning surrogates, physics-informed neural operators for electromagnetic forward and inverse problems, and data-driven constitutive modeling within FDTD solvers. Novel numerical methods addressing ill-posed discrete Maxwell systems and tensor-train-accelerated FDTD with logarithmic computational cost are also featured. Together, these works highlight the integration of physics-based rigor, machine learning, and low-rank numerical techniques to enable fast, accurate, and scalable simulation and design of complex microwave systems.
Tue
9
Tue 9 Jun | 15:40 - 17:20
Room 151AB
DetailsRFTT
Technical Sessions
Abstract
The session begins with a keynote review of load-modulated balanced power amplifiers. Subsequently, amplifiers that combine load modulation with balanced performance, as well as high-efficiency outphasing PAs, will be described. The session will conclude with high-efficiency PA techniques utilizing various technologies.
Tue
9
Tue 9 Jun | 15:40 - 17:20
Room 153AB
DetailsRFTT
Technical Sessions
Abstract
This session addresses advances in design automation, including developments in the growing fields of artificial intelligence (AI), digital twins, and deep learning for the design and optimization of circuits and systems. It presents works on system-oriented layout optimization of active circuits, continuation algorithms for nonlinear simulation, machine-learning-assisted design, and pixelated optimization and synthesis of passive structures. This session is held in honor of Vladimir G. Gelnovatch.
Wed
10
Wed 10 Jun | 08:00 - 09:40
Room 151AB
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Technical Sessions
Abstract
As quantum computing advances toward scalable and fault-tolerant architectures, the integration of high-fidelity qubits with cryogenic microwave electronics becomes a critical enabling factor. This focus session provides a unique platform to foster collaboration among the quantum hardware, cryogenic electronics, and microwave engineering communities, accelerating the path toward practical, fault-tolerant, and large-scale quantum computing systems. It brings together experts from industry and government laboratories to present recent advances in superconducting, semiconductor spin, and ion-trap qubit technologies, the associated cryogenic control and readout electronics, and quantum processor architectures.
Wed
10
Wed 10 Jun | 08:00 - 09:40
Room 153AB
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Technical Sessions
Abstract
This session introduces advanced Doherty power amplifiers with power level greater than 10W over FR1 and FR3.
Wed
10
Wed 10 Jun | 08:00 - 09:40
Room 156AB
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Technical Sessions
Abstract
This session highlights key advances in novel 3D components, substrate technologies, and subsystem packaging, including Multi-Chip Modules (MCMs) and additive manufacturing techniques such as metal and 3D printing. The papers explore heterogeneous integration and shape-changing materials, alongside technologies operating above 100GHz. Featured works include high-efficiency PAs, pH sensors, and low-cost techniques for reconfigurable antenna elements and lenses.
Wed
10
Wed 10 Jun | 08:00 - 09:40
Room 157AB
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Technical Sessions
Abstract
This session presents the latest advances in reconfigurable components and systems, as well as true-time-delay structures. The presented papers cover a range of topics, such as tunable filters, limiters, and delay structures. Additionally, a full-duplex antenna integrated into a substrate-integrated waveguide (SIW) using spatiotemporal modulation is presented.
Wed
10
Wed 10 Jun | 10:10 - 11:50
Room 151AB
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Technical Sessions
Abstract
This session presents recent advances in compact modeling for commercial simulators, specifically targeting cryogenic and quantum applications. The papers feature a physics-based, temperature-dependent compact model for cryogenic spiral inductors, as well as an investigation into the suitability of embedded wafer-level BGA packaging for RF cryogenic use. Finally, the session introduces a reflective phase-shifter optimized for these extreme environments.
Wed
10
Wed 10 Jun | 10:10 - 11:50
Room 153AB
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Technical Sessions
Abstract
This session presents state-of-the-art developments in high-efficiency power amplification, focusing on advanced GaN, GaAs, and switched-capacitor architectures for Ku-band and 6G FR3 applications. The featured papers explore sophisticated techniques for bandwidth extension and linearity enhancement, including a broadband GaN Doherty Power Amplifier (DPA) utilizing relative input phase compensation and a continuous-mode harmonic-tuning MMIC DPA achieving an 18.7% fractional bandwidth. Innovations in non-reciprocal and phase-control circuits are highlighted through a vector-sum phase-shifter for analog pre-distortion in GaAs HBT and a GaN-on-Si DPA employing a differential power combiner for enhanced performance in the FR3 band. The session concludes with a digital-intensive intra-cell IQ Generation SCPA that leverages time-domain charge redistribution to achieve high drain efficiency, collectively demonstrating diverse semiconductor strategies to meet the stringent requirements of next-generation wireless systems.
Wed
10
Wed 10 Jun | 10:10 - 11:50
Room 156AB
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Technical Sessions
Abstract
Phase and amplitude control blocks are central to scalable phased array beamforming, but pushing bandwidth, accuracy, bidirectionality, and integration density simultaneously remains challenging. This session highlights recent circuit innovations that deliver phase-invariant gain control, wideband vector-modulation phase shifting, and switchless bidirectional operation. The papers span ultracompact reciprocal phase-inverting architectures, broadband bidirectional amplitude–phase control for multibeam transceivers, and phase-compensated VGA designs over wide tuning ranges.
Wed
10
Wed 10 Jun | 10:10 - 11:50
Room 157AB
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Technical Sessions
Abstract
This session presents novel works related to non-planar filters and multiplexers. The papers discuss compact waveguide quadruplet filters realized with advanced topologies, diplexer designs with compact footprints based on innovative synthesis techniques, and compact metal-insert dual-band filters. Additionally, the session explores ridge-waveguide filters and diplexers designed for high-performance applications.
Wed
10
Wed 10 Jun | 12:00 - 13:30
Room 156C
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Panel Session
Abstract
This panel is for academics and commercial attendees who need a deeper understanding of the opportunities for RF/UW components and solutions as part of a quantum solution and are determining when the industry will reach quantum advantage and what impact that has the RF industry.
Quantum industry experts and leaders will provide insights into the state of the quantum industry, where and how RF/uW components are used and what can be expected in the future. They will also discus educational requirements for this industry and where to look for opportunities.
Wed
10
Wed 10 Jun | 13:30 - 15:10
Room 151AB
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Technical Sessions
Abstract
This session presents new advances in quantum computing and cryogenic circuits. The keynote address explores the challenges and microwave aspects of superconducting quantum processor readout. Subsequent papers feature a cryogenic FD-SOI fractional-N PLL for trapped-ion applications and high-performance cryogenic LNAs designed for both superconducting quantum computing and radio astronomy.
Wed
10
Wed 10 Jun | 13:30 - 15:10
Room 153AB
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Technical Sessions
Abstract
This session is dedicated to showing the most recent advances in machine learning techniques for the linearization of power amplifiers under diverse dynamic scenarios, including variations in power, bandwidth, and center frequency.
Wed
10
Wed 10 Jun | 13:30 - 15:10
Room 156AB
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Technical Sessions
Abstract
This session includes a keynote talk on InP circuits for optical communication, followed by three papers discussing state-of-the-art technologies: a 270GHz bandwidth InP wideband amplifier, a mm-wave VCO, and a low-jitter 5GHz sampling PLL.
Wed
10
Wed 10 Jun | 13:30 - 15:10
Room 157AB
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Technical Sessions
Abstract
This session covers the latest developments in compact time-delay phase shifter circuits, filters, and switches based on novel approaches using phase-change materials (PCM), magnetic, and MEMS technologies. The session includes commercially viable GeTe-based PCM switches and tunable magnetic filters over a broad frequency band. At the end of the session, an RF-MEMS-based SP4T switch is also presented.
Wed
10
Wed 10 Jun | 15:10 - 17:00
Room Exhibit Hall Floor
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Interactive Forum
Thu
11
Thu 11 Jun | 08:00 - 09:40
Room 151AB
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Technical Sessions
Abstract
This session focuses on mm-wave and sub-THz power amplifiers in InP, GaN, and CMOS technologies, covering E-band to D-band frequencies for next-generation communication, radar, and sensing applications. Featured works include advanced techniques in slot-line and 32-way power combining, loss-optimized matching networks, and a broadband distributed amplifier (DA) architecture utilizing a tapered coupled-line approach.
Thu
11
Thu 11 Jun | 08:00 - 09:40
Room 153AB
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Technical Sessions
Abstract
Spanning X-band to D-band, this session highlights wideband receiver front-end techniques. Featured papers discuss reflectionless concepts with fast AGC, transformer-assisted designs, ultra-wideband sub-THz LNAs, and high-linearity passive mixer-first receivers in RFSOI. These contributions address the critical trade-offs in noise, gain flatness, and interference robustness required for next-generation multi-gigabit sensing and communication.
Thu
11
Thu 11 Jun | 08:00 - 09:40
Room 156AB
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Technical Sessions
Abstract
This session presents passive components and circuits based on innovative integration techniques, targeting applications from the GHz to the sub-THz spectrum.
Thu
11
Thu 11 Jun | 08:00 - 09:40
Room 157AB
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Technical Sessions
Abstract
This session covers advanced integrated passive devices operating at frequencies ranging from several-GHz to 300GHz. Specifically, it highlights the development of a fully differential, ultra-compact broadband rat-race coupler using folded-inverted coupled lines in 180nm CMOS, and an ultra-wideband, low-loss, and high-isolation Wilkinson power divider utilizing a multiple-resonant technique. Additionally, the session addresses a 220–340GHz Marchand balun with an asymmetric ground shield in 90nm SiGe BiCMOS, along with a miniaturized 150GHz branch-line coupler using capacitive compensation in quartz-IPD technology.
Thu
11
Thu 11 Jun | 10:10 - 11:50
Room 151AB
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Technical Sessions
Abstract
This session highlights recent advances in sub-THz and THz circuits and components, spanning signal generation, frequency translation, reception, and waveguide technologies. The five papers include a 312GHz low-voltage push-push oscillator in GaAs pHEMT technology, a broadband CMOS frequency doubler with high fundamental suppression, and a sub-milliwatt receiver MMIC achieving low noise across a wide bandwidth. Complementing these active circuits are innovations in THz signal routing and multiplication, including metallized 3D-printed 1THz hollow waveguide components and a 480–530GHz balanced frequency quadrupler based on Schottky-varactor diodes integrated on a micromachined silicon membrane.
Thu
11
Thu 11 Jun | 10:10 - 11:50
Room 153AB
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Technical Sessions
Abstract
This session presents the latest developments in power amplifiers for HF, VHF, and UHF bands. The keynote paper introduces the Aurora transceiver, which integrates digital signal processing with high-efficiency amplification. This is followed by a Class-EF amplifier designed for VHF operation. The session continues with a paper utilizing digital pulse-width modulation to generate RF signals over a wide bandwidth. Finally, two papers address techniques for enhancing power amplifier robustness against variable load impedances.
Thu
11
Thu 11 Jun | 10:10 - 11:50
Room 156AB
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Technical Sessions
Abstract
This session discusses new research findings in circuit design and synthesis methods for planar filters with enhanced RF performance. Specifically, it covers novel concepts for achieving reflectionless behavior, flat group-delay, and passband flatness while accounting for loss and selectivity-enhancement methodologies for acoustic filters.
Thu
11
Thu 11 Jun | 10:10 - 11:50
Room 157AB
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Technical Sessions
Abstract
Join us for the latest research in RF switching and power amplification. Explore advances in RF switch technology, including an analysis of SOI-switch substrate losses, GaN-on-silicon switch technology, and non-volatile GaN switch devices. For RF power modeling, we will investigate high-linearity design using two-tone load-pull and accurate large-signal device modeling of GaN power stages.
Thu
11
Thu 11 Jun | 12:00 - 13:30
Room 156C
DetailsRFTTRFSA
Panel Session
Abstract
This inter-society technical panel will emphasize the urgent need for sustainable growth within the RF industry, particularly through the development of standards for measuring the carbon footprint of RF technologies. Today, the environmental impact of RF systems extends across the full lifecycle—from manufacturing processes and material usage to deployment, energy consumption, and long-term operation. However, the absence of consistent measurement frameworks makes it difficult to evaluate, compare, and ultimately reduce these impacts in a systematic way.
The panel will bring together experts from multiple societies to explore how collective action can establish widely accepted methodologies and best practices for carbon footprint assessment in RF technologies. By working across organizational boundaries, societies can not only help define these standards but also provide strategic guidance to industry, academia, and policymakers. Such efforts are critical to ensuring that sustainability becomes a foundational consideration in future RF innovations rather than an afterthought.
Ultimately, the discussion will highlight how professional societies can play a pivotal role in shaping a greener future for the RF industry—by fostering collaboration, driving standardization, and offering direction to reduce carbon emissions across both manufacturing and operational domains.
Thu
11
Thu 11 Jun | 12:00 - 13:30
Room 157
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Panel Session
Abstract
Artificial Intelligence is revolutionizing microwave circuit design, just as it is transforming other scientific and industrial domains. The growing number of published research papers demonstrates that the microwave community is actively embracing AI and ML across a wide spectrum of applications—from novel device modeling to virtual data generation, data management, and advanced EDA tools for circuit optimization. New commercial solutions for ML-assisted circuit design, already offer first-pass, fully automated layout generation, multi-objective optimization, and seamless multi-platform integration from device to system level. This evolving landscape suggests a progressive shift in researchers' focus from traditional design practices toward a complex interplay involving the development of custom, high-accuracy, dynamically reconfigurable models, advanced EDA algorithms, and ML workflows.
Are we ready for this revolution? Can we truly trust AI/ML-driven design? Will AI really help to uncover entirely new device concepts and circuit topologies, or will it remain a highly capable design assistant? What tools and skills are needed to become active contributors in this new paradigm?
This panel will bring together experts from foundries, model development, and EDA vendors to critically examine the pros and cons, practical implications, IP constraints and future directions of AI-assisted microwave circuit design.
Thu
11
Thu 11 Jun | 13:30 - 15:10
Room 151AB
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Technical Sessions
Abstract
This session covers a wide range of high-power amplifier topics, including novel load-modulation architectures, advanced baseband manipulation for dual-band operation, and unconventional broadband designs.
Thu
11
Thu 11 Jun | 13:30 - 15:10
Room 153AB
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Technical Sessions
Abstract
This session is dedicated to showing recent advances in linearization techniques for transmitters and receivers in MIMO applications, incorporating both analog and digital compensation.
Thu
11
Thu 11 Jun | 13:30 - 15:10
Room 156AB
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Technical Sessions
Abstract
This session presents papers covering a variety of innovative passive components. The featured works discuss Gysel power combiners, methodologies to increase power handling and multipaction thresholds for compact filters, and couplers with tunable coupling values. Additionally, the session explores resonator-based sensors and design considerations for radial power combiners.
Thu
11
Thu 11 Jun | 13:30 - 15:10
Room 157AB
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Technical Sessions
Abstract
This session highlights recent advances in field analysis and experimental characterization techniques enabling next-generation electromagnetic applications. The presented works span high-speed interconnect modeling, topological-wave phenomena for crosstalk suppression, and rigorous experimental studies of surface roughness and time-varying ferrite structures. In addition, quasi-analytical methods for blind-scan-angle estimation in surface-mounted antenna arrays are introduced. Collectively, these contributions emphasize the tight integration of analytical modeling, numerical methods, and experimental validation to address emerging challenges in high-speed, reconfigurable, and unconventional electromagnetic systems.