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The talk will cover the use of photonics-based THz generation to enable THz communication/testing of active and passive devices (eg Reflective Surfaces, waveguides, beamformers), in the range 140–800G...
There is an urgent need to develop efficient frequency converters and signal sources that can operate up to frequencies close to 5THz without cryogenic cooling — beyond the limit of transistor technol...
SiGe BiCMOS and advanced wafer-level packaging technologies are highly desired to realize high performance (sub-) THz systems. In this talk, state-of-the-art SiGe BiCMOS technology with wafer-level pa...
We demonstrate our efforts in addressing the design challenges of CMOS electronics for THz sensing and communication applications, including optimizing transistor layout for speed enhancement, develop...
This talk presents antennas and packaging for a sub-THz wireless point-to-multipoint link operating in the 220–325GHz frequency range. A point-to-multipoint link is an attractive solution for a sub-TH...
High electron mobility transistors (HEMTs) have demonstrated operation beyond 1THz, indicating significant potential for RF front-ends in both future communication and sensing applications. In this ta...
This talk looks at some current challenges and advances in mm-wave and THz test equipment. In particular, spectral purity of mm-wave signal sources and downconverters is addressed, both at full power ...
We will present recent advances for on-wafer device and material testing at mm-wave and THz bands using non-contact probing as a cost-effective and highly repeatable alternative to conventional contac...
Integrated Sensing and Communication (ISAC) is a transformative technology that merges the capabilities of communication and sensing systems into a unified platform. This seminar delves into the core ...
High-frequency on-wafer S-parameter measurements present significant challenges due to various factors that can impact accuracy and consistency. Efforts are underway to address these challenges and en...