Microwave Week 2020 Dashboard

Technical Session Audience Rating IMS

Displaying 2701 - 2750 of 2759
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  • IF1-18: A High-Efficiency Outphasing Power Amplifier Utilizing a Synthesized Direct-Matching Technique Based on Two-Section Branch-Line Coupler Output Combiner
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  • IF1-22: Ultra-Wideband 6-Bit Passive Phase Shifter with Open-Circuit Microstrip Pseudo-π Network and Low RMS Phase Error
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  • IF1-28: High Power-Added-Efficiency AlGaN/GaN E-Mode HEMTs for Low-Supply-Voltage RF Terminal Applications
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  • IF1-32: S-Parameter-Based Simulation Technique and Crosstalk Suppression for Large-Scale Superconducting Quantum-Computing Chip Design
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  • IF1-38: Fast-Switchable 3.6GHz GaN Doherty Power Amplifier for Energy-Efficient Non-Continuous Transmission of 256-QAM Signals
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  • IF1-44: A 30-mW D-Band High-Sensitivity Self-Injection-Locked Radar Sensor with Integrated SIW Antenna in 70-nm GaAs pHEMT Technology
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  • Th1A-2: Empty-SIW (eSIW) Based Beamformer System on Glass Package for G-Band Phased Array Applications
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  • Th1B-1: Edge Coupled DC–60GHz Differential SPDT MEMS Switch for High-Speed Digital Applications
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  • Th1C-2: A Compact Millimeter-Wave Phase Shifter Integrated Variable Coupler in SIW Technology for Beam-Forming Applications
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  • Th1D-3: Temperature and Humidity Effects on Electromagnetic Waves Utilizing 140GHz Radar Measurements
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  • Th1F-3: A Compact Wideband Low-Loss On-Chip Power Combiner for High-Efficiency GaN mm-Wave Power Amplifiers
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  • Th1G-4: A >22GS/s, 44dB SNDR Wideband 4×4 Time-Interleaved Sampling Front-End with Bulk-Driven Mismatch Calibration in 22nm FDSOI
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  • Th2A-2: 3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
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  • Th2B-2: Low-Loss Longitudinal Leaky SAW Filter with 1350MHz Bandwidth on LiNbO₃/SiO₂/SiC Platform for Wi-Fi 7
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  • Th2C-2: A Miniaturized Marchand Balun-Based Broadband Vector Sum Phase Shifter with 0.49° RMS Phase Error
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  • Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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  • Th2F-3: 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
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  • Th2G-3: An 86–90GHz Adaptive Gain CMOS LNA with Linearity Enhancement & -6dBm Blocker Tolerance
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  • Th3A-1: Flexible Focalization: An Addititively Manufactured, Conformal, Low-Profile Multilayer Transmitarray for Space-Based 5G/mmWave Applications
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  • Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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  • Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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  • Th3C-3: A Magnetostatic Surface Wave Filter Tunable Over 8–32GHz Realized in Thickness Scaled Yttrium Iron Garnet
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  • Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
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  • Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
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  • Th3G-3: Broadband LNA with Dual-Resonance Matching Network with Capacitive Feedback for Improved Gain and Noise Figure Using 0.1-µm GaAs pHEMT Technology
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  • WSG-3: SiGe BiCMOS Process for SATCOM Applications
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  • WSM-1: Scaling AI Cluster Performance with WDM Optics
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  • WSL-3: Transformer-Based mm-Wave PA Design in CMOS, InP and GaAs
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  • WSI-1: Lab-to-Fab Transition of CMOS Simultaneous Transmit and Receive (STAR) Research
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  • WSO-9: On-Wafer LNA Noise Measurements for Cryogenic LNAs
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  • WSR-4: mm-Wave Rectennas with Diode-on-Antenna Topology and Antenna-on-Chip Structure
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  • WMK-5: Potential—and Challenges—of Ultra-Wide Band Gap Devices for RF Applications
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  • WMG-9: Thermal Management Solutions to GaN Electronics
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  • WSR-4: mm-Wave Rectennas with Diode-on-Antenna Topology and Antenna-on-Chip Structure
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  • WMK-5: Potential—and Challenges—of Ultra-Wide Band Gap Devices for RF Applications
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  • WMG-9: Thermal Management Solutions to GaN Electronics
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  • WSR-4: mm-Wave Rectennas with Diode-on-Antenna Topology and Antenna-on-Chip Structure
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  • WSG-9: Bringing Commercial Cellular Access to Space
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  • WSH-9: Progress in Commercial Realization of mm-Wave Heterogeneous Circuits
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  • WSR-4: mm-Wave Rectennas with Diode-on-Antenna Topology and Antenna-on-Chip Structure
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  • WSG-9: Bringing Commercial Cellular Access to Space
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  • WSH-9: Progress in Commercial Realization of mm-Wave Heterogeneous Circuits
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  • WSR-2: Development of Batteryless IoT Sensors using SWIPT Technologies
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  • WMK-2: Materials and Device Engineering for High-Performance AlGaN RF Electronics
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  • WMD-8: An electrostatic platform for quantum acoustics
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  • WSR-2: Development of Batteryless IoT Sensors using SWIPT Technologies
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  • WMK-2: Materials and Device Engineering for High-Performance AlGaN RF Electronics
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  • WMD-8: An electrostatic platform for quantum acoustics
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  • WSR-5: Design of 28GHz Wireless Power Transfer Phased Array in Beyond-5G/6G Networks
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  • WSB-8: Scalable integrated sensing and communication: technologies and experimental study
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