Microwave Week 2020 Dashboard

Technical Session Audience Rating IMS

Displaying 2351 - 2400 of 2742
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  • We3G-5: A 134GHz High Efficiency High Power Fundamental Oscillator in 16nm p-FinFET with 12dBm Output Power and 6.5% DC-to-RF Efficiency
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  • IF1-1: Ku-Band Multi-Functional Bandpass Filtering Isolators (BPFIs) Using GaAs Coupled-Line-Based Unilateral Frequency-Selective Stages
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  • IF1-7: A TSPC mm-Wave Frequency Divider with up to 50GHz Input Frequency in 12nm FinFET Bulk CMOS
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  • IF1-13: A Wideband TIA-Driver Unit in 22-nm CMOS FDSOI for Integrated Microwave Optoelectronic Oscillators
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  • IF1-20: A THz Attenuator Based on Voltage-Tunable Whispering Gallery Mode Resonator
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  • IF1-23: A 28nm CMOS Almost All-Digital 0.5 to 4.0GHz Ultra-Wideband Ground Penetrating Radar for Lunar Surface Exploration
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  • IF1-29: GaN Trap Model Extraction Based on MHz Load-Line Measurements
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  • IF1-35: An Effective Basis Function Generation Structure for Digital Pre-Distortion in Wideband Scenarios
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  • IF1-40: TCN-DPD: Parameter-Efficient Temporal Convolutional Networks for Wideband Digital Predistortion
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  • IF1-47: A Body-Floating G-Band Frequency Doubler for Astronomical Receiver in 90-nm CMOS Process
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  • Th1A-3: Evaluation of Stacked Structure for 160GHz End-Fire Type Compact Antenna-in-Package Considering Thermal Design
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  • Th1B-2: A Low-Loss, Wideband, 0–110GHz SPDT Using PCM RF Switches with Integrated CMOS Drivers
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  • Th1C-4: Twisted-Shaped Millimeter-Wave Hybrid Couplers in 150nm GaN Technology for 5G Applications
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  • Th1D-5: A Novel Q-Choked Sapphire Sandwiched Resonator for Wide-Band Measurements of Flat Dielectric Samples
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  • Th1G-2: DC-to-89-GHz AMUX-based IQ Modulator in 250-nm InP HBT Technology for Multiplexing-DAC Subsystem
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  • Th1G-5: A 0.9pJ/Bit 56Gb/s High-Swing Tri-Mode Wireline Transmitter with 6-Bit DAC Controlled Tailless-CML Driver and Impedance Calibration Loop
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  • Th2A-4: First Demonstration of Highly Scaled RF GaN-on-Si Dielets Embedded in Glass Interposer
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  • Th2B-4: Miniature High-Coupling Lithium Niobate Thin Film Bulk Acoustic Wave Resonators at 10–30GHz
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  • Th2C-5: A Novel Multi-Functional Filtering Amplitude/Phase Circuit with Tunable Frequency Using Simple Phase Control Network
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  • Th2D-4: Cross-Spectrum Phase Noise Measurements of 10-15-Level Stability Photonic Microwave Oscillators
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  • Th2F-5: A Broadband InP Darlington Amplifier with Two-Way Distributed Power Combining
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  • Th2G-5: A 6.5-GHz Low-Power Self-Interference Cancellation Receiver with Two-Stage Feedforward Technique and Automatic Gain Control Loop
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  • Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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  • Th3B-2: On-Wafer Characterization of K-Band to V-Band GaN IMPATT Diodes
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  • Th3B-4: Influence of Double-Deck T-Gate Structures on Cut-Off Frequency in Al0.3Ga0.7N/AlN/GaN HEMTs
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  • Th3D-1: KEYNOTE: Past, Present and Future Challenges of Testing RFIC Industry
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  • Th3F-1: Algorithmic Design of Nonintuitive On-Chip Multilayered Passive Networks
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  • Th3G-1: A C/X-Band LNA Leveraging a Voltage-Tapered Gain-Cell Stacking Technique for 6G and IR-UWB
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  • WSD-2: FD-SOI: game changer in the IoT arena
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  • WSG-3: SiGe BiCMOS Process for SATCOM Applications
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  • WSH-1: The Defense Advanced Research Projects Agency’s (DARPA) Next Generation Microelectronics Manufacturing (NGMM) Program
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  • WSL-8: Stacked-FET CMOS Power Amplifier for mm-Wave and Sub-THz Applications
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  • WSI-8: Integrated Self-Interference Cancelers for Fully-Duplex Radios
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  • WSN-4: Interconnect Challenges for Scalable Quantum Computing
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  • WSF-4: Vision on Phased Arrays Using Meta-Surfaces and on the Implementation of LO Phase Shifting Based on ILOs
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  • WSB-3: Toward Integrated mm-Wave Communication and Sensing with Compressive Beam Shaping Techniques
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  • QUB1-1: Introduction to Quantum Computing: Qubits, Gates, and Algorithms
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  • WSR-3: Combined System of Wireless Power Transfer and Communication
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  • WMI-9: Design and Simulation of Waveguide-Based Devices in 2D Dirac Materials
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  • WMG-6: Innovations in GaN-on-Silicon Technology for High Performance Power and RF Applications
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  • WML-10: Butterfly Matrices and Tensors: New Tools for High-Frequency Integral and Differential Equation Solvers, and High-Dimensional Transforms
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  • WMK-6: Ga₂O₃ FETs for Future Power and Harsh Environment Electronics
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  • WMM-6: Adaptive RF Front-Ends as a Key Enabler of Modern Communication Systems
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  • WMF-5: Broadband Differential On-Wafer Measurements: Challenges in De-Embedding, Drive Control and Related Aspects
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  • WMJ-5: 3D-Printed RF Devices and Antennas for Sensing
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  • WMN-6: Die-Embedded Glass Packaging Technology
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  • WMO-6: Radar Applications in Mobile Phones for Ambient Awareness and Health Sensing
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  • RFB1-6: Design, Modeling and Operation of Antennas, Arrays and Metasurfaces in mmWave and THz Communications
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  • WMQ-2: Characterizing Low-Frequency Memory Effects using RF Real-Time NVNA Measurements
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  • Tu1A-2: A D-Band 1Tx 4Rx Mid-Range Automotive CMOS FMCW Radar
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