Microwave Week 2020 Dashboard

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Displaying 2201 - 2250 of 2759

Th2A-2: 3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
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Th2B-2: Low-Loss Longitudinal Leaky SAW Filter with 1350MHz Bandwidth on LiNbO₃/SiO₂/SiC Platform for Wi-Fi 7
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Th2C-2: A Miniaturized Marchand Balun-Based Broadband Vector Sum Phase Shifter with 0.49° RMS Phase Error
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Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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Th2F-3: 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
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Th2G-3: An 86–90GHz Adaptive Gain CMOS LNA with Linearity Enhancement & -6dBm Blocker Tolerance
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Th3A-1: Flexible Focalization: An Addititively Manufactured, Conformal, Low-Profile Multilayer Transmitarray for Space-Based 5G/mmWave Applications
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Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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Th3C-3: A Magnetostatic Surface Wave Filter Tunable Over 8–32GHz Realized in Thickness Scaled Yttrium Iron Garnet
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Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
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Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+
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Th3G-3: Broadband LNA with Dual-Resonance Matching Network with Capacitive Feedback for Improved Gain and Noise Figure Using 0.1-µm GaAs pHEMT Technology
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WSG-2: Multi-Orbit SATCOM Terminals for NTN and the Components that Make These Viable
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WSM-6: In-Package Silicon Photonic Transceivers for Next-Gen AI/HPC Systems
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WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
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WSA-7: Design and Performance Characterization of PLL-Based Chirp Generators for FMCW Radar Applications
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WSO-6: MOSFET Modeling with the sEKV Model for the Design of Cryo-CMOS Circuits
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WSF-1: Wideband TTD Reflectarrays for Multi-Standard 5G/6G Systems
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WSC-6: AI/ML for Microwave Modeling and Optimization
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WSK-6: Characterization and Modeling of HEMTs Beyond 110GHz
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WSQ-5: Accelerating High-Frequency Circuit Design Using Advanced AI Algorithms
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WMI-6: Trapped-Ion Quantum Computing at Quantinuum
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WMG-1: GaN-on-SiC vs. GaN-on-Si: Emerging Opportunities and Market Dynamics in the RF GaN Industry
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WML-5: Towards a Unified Theory that Reveals the Essence of Numerical Methods in Electromagnetics
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WMK-3: The Role and Challenges of Ultra-Wide Bandgap Semiconductors in Next-Generation GaN HEMTs
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WMM-2: Digital Self-Interference Cancellation for Different Modulation Formats
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WMM-11: Component and System-level Approaches for Analog Interference Mitigation
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WMA-6: Diamond-Metal Composite Package for High-Power RF Device
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WMN-1: Microwave and mm-Wave Multifunction Filtering Circuits Using Three-Dimensional High-Integration Technology
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WMO-1: Workshop Overview
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WPTB1-5: High Power/Energy Wireless power Beaming components and Systems
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WMP-2: An Overview of Equalization Techniques for Serial Communication Channels
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Tu1A-1: A Fully Integrated Ka-Band FMCW Radar SoC with Baseband Accelerator for Vital Signs Monitoring in 40-nm CMOS
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Tu1A-5: Radar-Based Measurement of Image Rejection Ratio in Sub-THz Hartley Receivers with its Impact on Doppler Detection Accuracy
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Tu1C-1: Field Trial of a Coastal Surveillance System Exploiting a Multistatic Multiband Photonics-Based Radar in Coherent Sparse MIMO Configuration
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Tu1D-2: A 7GHz High Efficiency GaN Doherty Power Amplifier Module for 5G Massive MIMO Base-Stations
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Tu1E-3: A Cryogenic Push-Pull Class-C Dual-Mode VCO with 72%-Tuning Range for Quantum Applications
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Tu1F-3: A Highly Efficient Design of Triple-Band Flexible Rectenna for Ambient RF Energy Harvesting in Passive IoT Applications
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Tu2A-5: Three-Dimensional Fourier Domain Millimeter-Wave Imaging Using Incoherent Active Illumination and Pulse Compression
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Tu2C-2: On-Chip Photonic THz Emitter with Integrated InGaAs UTC-PD and 2×2 MPA Array on SiC Substrate
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Tu2D-1: RF-Input Doherty-Like Load-Modulated Balanced Amplifier with Decade Bandwidth Enabled by Novel Broadband 180-Degree Power Divider
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Tu2E-1: An Embedded-Structured Convolutional Neural Network for Efficient RF Device Behavior Model Extraction
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Tu2E-6: AdaAFE-CIM: A Hardware Implementation of Subspace Tracking for Adaptive Radar Data Compression
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Tu2F-5: Compact Design of Highly-Efficient Dual-Band Voltage Doubler Rectifier by Using Second-Harmonics Suppression for Wireless Power Transfer
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Tu3B-1: 150GHz-Band Compact Phased-Array AiP Module for XR Applications toward 6G
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Tu3B-2: A 28GHz Beamformer Element Demonstration Using Monolithically Integrated GaN and Si Transistors in 300mm GaN-on-Si Technology
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Tu3C-4: Predistortion Linearization: Concepts, The State of the Art, and the Future
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Tu3E-2: An Integrable Analog Domain Linearization Architecture for the Power Amplifiers in MIMO Systems
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Tu3F-4: Differential Frequency Selective Surface Sensor for Polymeric Coating Damage Detection Using Electromagnetically Shielded Reference Resonator
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Microwave Week 2020 Dashboard

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