Microwave Week 2020 Dashboard

Technical Session Audience Rating IMS

Displaying 2301 - 2350 of 2742
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  • Th1A-1: A D-Band Tx FOWLP Module with Silicon-Based Resonator Antenna Array
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  • Th1A-5: An Antipodal SIW-Fed Vivaldi Antenna at D-Band in LTCC for Flip-Chip RFIC Integration
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  • Th1C-1: Innovative Hybrid Stripline Guiding Structure for Wideband Crossover Implementation
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  • Th1D-3: Temperature and Humidity Effects on Electromagnetic Waves Utilizing 140GHz Radar Measurements
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  • Th1F-2: E-Band Power Amplifier with 32.2dBm Psat, 31.3dBm OP1dB Utilizing Commercial 0.10-µm GaAs pHEMT Technology
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  • Th1G-3: A 132GHz SiGe BiCMOS Sampler for Linear Front-Ends
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  • Th2A-1: Novel Low-Loss Shielded Interconnects for D-band/sub-THz Applications Using Microscale Metal Printing Technologies
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  • Th2B-2: Low-Loss Longitudinal Leaky SAW Filter with 1350MHz Bandwidth on LiNbO₃/SiO₂/SiC Platform for Wi-Fi 7
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  • Th2C-1: A Reconfigurable Filtering Circulator/Isolator with Continuously Controllable Center Frequency and Insertion Phase
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  • Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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  • Th2F-2: 300-GHz-Band InP HBT Power Amplifier Module Enabling 280-Gbps 0-dBm Signal Generation with Digital Predistortion
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  • Th2G-2: A 130GHz 360° Gain-Invariant Phase Shifter with 5.625° Phase Resolution, 0.19° RMS Phase Error and < 0.56dB RMS Gain Error
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  • Th3A-1: Flexible Focalization: An Addititively Manufactured, Conformal, Low-Profile Multilayer Transmitarray for Space-Based 5G/mmWave Applications
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  • Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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  • Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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  • Th3C-2: Tunable Dual-Band Coaxial Filter with Independent Band Control Using a Single Tuning Element Per Band
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  • Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
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  • Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+
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  • Th3G-3: Broadband LNA with Dual-Resonance Matching Network with Capacitive Feedback for Improved Gain and Noise Figure Using 0.1-µm GaAs pHEMT Technology
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  • WSE-1: Integrating FR2 OAI and Hybrid RIS: Enhanced Network Management Implementing FR2 OAI, ORAN, and RIS
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  • WSM-1: VLC/LiFi for NextG Wireless
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  • WSH-8: Glass Core Technology as a Building Block for Advanced Packaging Architectures
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  • WSA-1: Reference Oscillator Architectures and Design Considerations
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  • WSO-1: Superconducting Qubits: Wiring up Quantum Entanglement
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  • WSJ-1: Gallium Nitride on Silicon Carbide Technologies for Sub-20GHz Applications
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  • WSF-5: Navigating the Challenges of 300GHz CMOS Transceivers: A Comparative Analysis with Photonics-Based and D-Band CMOS Configurations
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  • WSB-5: Joint Sensing and Communication Under Hardware Impairments
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  • QUB1-3: Industry perspective: Quantum computing at Google
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  • AIB1-2: AI for 3D Radar – Approaches and Opportunities
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  • WMI-10: Efficient Single Photon Sources Based on Quantum Metasurfaces
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  • WMG-7: Challenges and Opportunities of GaN-on-Si Technology for Wireless Applications in the FR3 (8–24GHz) Band
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  • WMD-1: RF Acoustic Wave Resonators, Getting Started
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  • WMK-6: Ga₂O₃ FETs for Future Power and Harsh Environment Electronics
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  • WMM-7: Balanced Single-Antenna RF Transceiver Architectures for Frequency-Agile Full-Duplex Wireless Communications
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  • WMF-7: On-Wafer Characterization of Sub-THz InP HBTs: Importance of Choosing the Proper Error Correction Algorithm
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  • WMJ-7: Sustainable Materials-Enabled Microwave Sensors: Are We Considering Manufacturing?
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  • WMN-8: Electromagnetic Modeling and Simulation Challenges for Silicon Interposers in 2.5D/3D IC Chip Design
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  • WMO-7: Understanding the Nuances of Being Human: Implications for Radar-Based Human Motion Classification
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  • RFB1-7: Tx/Rx Communications System Digital-to-RF Design and Test
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  • WMQ-3: Advanced GaN HEMT Characterization and Modeling Techniques
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  • Tu1A-3: An 120GHz 8×8 FMCW MIMO Radar System With 90° Biaxial FOV for Autonomous Navigation of UAVs in 3-D Space
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  • Tu1B-2: A V-Band OOK Transmitter with 14.5Gbps Data Rate and 11.1% DC-to-RF Efficiency in 65nm CMOS
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  • Tu1C-3: Multi-Channel Integrated Microwave Photonic Transmitter for Radio-over-Fiber Systems
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  • Tu1D-4: A 400W Symmetric Doherty Power Amplifier Covering 1.8–2.7GHz
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  • Tu1E-5: A Demonstration of Multi-Floating Superconducting Qubits on a 3D Flip-Chip Platform with TLS Loss Mitigation via Apertures
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  • Tu2A-1: Frequency-Spatial Adaptive Digital Beamforming Technique for Range-Angle Decoupling With High-Resolution MIMO Radar
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  • Tu2B-3: Body-Resonance Human Body Powering
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  • Tu2C-4: High Sensitivity W-Band LEKID-Based On-Chip Polarimeter
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  • Tu2D-3: System-in-Package Doherty Power Amplifier Using Hybrid LDMOS/GaN Line-Up for 5G Macro Driver Applications
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  • Tu2E-4: Recurrent Neural Network Modeling of Radio Frequency Amplifiers for System-Level Simulation and Design
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