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Packaging plays a critical role in modern microelectronic systems. With the advent of the 5th and 6th generation wireless communication standards, tight co-integration of packaging and radio-frequency...
The talk provides an overview of recent developments in microwave components realization leveraging additive and hybrid fabrication technologies. Exploitation of available three-dimensional geometry f...
The novel die-embedded glass packaging technology integrates a 140GHz InP power amplifier (PA) into a glass substrate using micro-vias for interconnects, eliminating assembly and achieving less than 1...
The use of wearable electronic devices that can acquire vital-signs from the human body noninvasively and continuously is a significant trend for healthcare. The combination of materials design and ad...
As we approach the dawn of 6G, the boundaries of wireless communication are being redefined. Light communication, or LiFi, presents a paradigm shift in connectivity by leveraging visible light, infrar...
Chiplet packaging is progressing towards higher connection densities using micro-bumps and hybrid-bonding, which increase current densities and complicate power networks. Silicon interposers serve as ...
NASA’s current space astrophysics missions do not use THz technologies, but instead many are capitalizing on the developments of decades ago in visible and near-infrared detectors. This leaves opportu...
Superconducting THz detectors were first used in astronomy more than four decades ago, and fifteen years have passed since they were used very successfully on the Herschel Space Observatory. Recent te...
The development of Superconductor-Insulator-Superconductor (SIS) receivers at the National Astronomical Observatory of Japan (NAOJ) will be presented. NAOJ has participated in an international project...
Both interstellar medium and planetary atmospheres are incredibly rich in molecular species with spectral rotational and vibrational signatures that lie in the 0.5–5THz frequency range. Submillimeter ...