Superconducting qubits operate at the boundary between microwave engineering and quantum mechanics, making their control fundamentally dependent on a tight integration of classical control electronics...
Flip-chip packaging provides a compact, cost-effective, and scalable approach for integrating mm-wave Monolithic Microwave Integrated Circuit (MMIC) amplifiers into phased array front-ends. MMIC Lab h...
This paper provides a deep overview of the thermal behavior of 0.1-µm GaN HEMTs technology. As an intermediary between the device HEMT process and the MMIC circuit, the electrical model plays a crucia...
Technology scaling and advances in ADC capability are continuously pushing the boundaries of Software-Defined Radios (SDR) further into the territory of traditional mixer-based architectures. While SD...