Your search produced 1498 results

WSH-2: 3D Heterogenous Integration (3DHI) for Advanced Communications
We will discuss emerging substrate and module technologies being developed that incorporates antenna in package, embedded die, and thermal management solutions in D-band (140GHz) and beyond (G-band). ...
WSH-3: Glass-Based Packaging for Bits-to-RF and 3DHI Systems-in-Package
3DGS will present considerations around a manufacturing platform for the production of vertically stacked glass substrates with heterogeneously integrated surface mount devices for advanced RF systems...
WSH-4: Bits to Beams: How do You Simulate a Heterogeneously Packaged, Digitally Steered Phased Array?
As interest in heterogenous packaging has intensified, so has the need for an ecosystem that allows for simulation of these complex systems. This workshop will explore how to co-simulate complex syste...
WSH-5: Waferscale RF Silicon Interposer Packaging Technology for mm-Wave Phased Arrays and Radars
This talk focuses on imec’s 300mm RF Silicon Interposer packaging technology for mm-wave applications. Key modules of the technology will be introduced with advantages over both HDI PCB technology and...
WSH-6: Development of Co-Packaged Optics Technology for Photonics Applications
Co-packaged optics (CPO) is a new class of microelectronics that addresses the ever-increasing demand for high-speed, high-throughput communications for a variety of applications. Through the Office o...
WSH-7: Advances in Wafer-Level Packaging (WLP) and Heterogeneous Integration for mm-Wave Phased Arrays
mm-Wave phased arrays offer highly attractive capabilities for next generation communication and radar systems. The high operating frequency and highly scaled nature of these systems pose significant ...
WSH-8: Glass Core Technology as a Building Block for Advanced Packaging Architectures
Glass core packaging and stitch chip technologies are pivotal in advancing semiconductor packaging, enabling higher performance, reduced form factors, and improved thermal and electrical management. F...
WSL-1: InP HBT Technologies for Sub-THz Amplifiers
InP HBTs are the leading technology for power amplification in the 100–300GHz frequency band. InP Power Amplifiers (PAs) are currently deployed in high-frequency test and measurement equipment (VNA ex...
WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
The 100–300GHz band may prove useful for high-resolution radar imaging and for high-capacity point-point MIMO backhaul links; the transceivers therein may use linear arrays with ~0.1–1W output power p...
WSL-3: Transformer-Based mm-Wave PA Design in CMOS, InP and GaAs
This talk will discuss several mm-wave PAs, implemented and measured in 16nm FF, Bulk CMOS, InP and GaAs. The common-theme will be the use of transformers to reduce the area, to lower matching-losses ...